CYD09S36V18-167BBXC

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Mfr.Part #
CYD09S36V18-167BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 256FBGA
Stock
49,060
In Stock :
49,060

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Terminal Position :
BOTTOM
Memory Format :
SRAM
Output Characteristics :
3-STATE
Height Seated (Max) :
1.7mm
Mounting Type :
Surface Mount
Radiation Hardening :
No
JESD-609 Code :
e1
Package / Case :
256-LBGA
Mount :
Surface Mount
Length :
17mm
Address Bus Width :
18b
Sync/Async :
SYNCHRONOUS
Memory Type :
Volatile
Memory Width :
36
Memory Size :
9Mb 256K x 36
Pbfree Code :
yes
Number of Pins :
256
Published :
2006
Packaging :
Tray
Supply Voltage :
1.5V
Lead Free :
Lead Free
Operating Temperature :
0°C~70°C TA
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Peak Reflow Temperature (Cel) :
260
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
I/O Type :
COMMON
Base Part Number :
CYD09S36
Operating Supply Voltage :
1.8V
Factory Lead Time :
15 Weeks
Number of Functions :
1
Number of Terminations :
256
Nominal Supply Current :
570mA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Access Time :
4ns
Terminal Pitch :
1mm
Memory Interface :
Parallel
Word Size :
36b
Standby Voltage-Min :
1.4V
Pin Count :
256
Number of Ports :
2
RoHS Status :
ROHS3 Compliant
Supply Voltage-Max (Vsup) :
1.58V
Density :
9 Mb
Clock Frequency :
167MHz
Time@Peak Reflow Temperature-Max (s) :
30
Introducing Memory Infineon Technologies CYD09S36V18-167BBXC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:256-LBGA, Number of Pins:256, Operating Temperature:0°C~70°C TA, Base Part Number:CYD09S36, Number of Terminations:256, CYD09S36V18-167BBXC pinout, CYD09S36V18-167BBXC datasheet PDF, CYD09S36V18-167BBXC amp .Beyond Memory Infineon Technologies CYD09S36V18-167BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD09S36V18-167BBXC


Memory Infineon Technologies CYD09S36V18-167BBXC Overview

The Memory Infineon Technologies CYD09S36V18-167BBXC is a high-performance 9Mbit SRAM component designed by Infineon Technologies. It is housed in a compact 256FBGA package, enabling dense integration while maintaining a small footprint suitable for a variety of demanding applications. This SRAM device provides robust parallel interfacing, making it ideal for high-speed, high-bandwidth applications where rapid access to data is critical. The Memory Infineon Technologies CYD09S36V18-167BBXC supports a wide range of operating temperatures, ensuring reliability and stability in diverse environmental conditions. This makes it an exemplary choice for businesses looking to invest in top-tier memory solutions that offer both performance and durability.

CYD09S36V18-167BBXC Features

The CYD09S36V18-167BBXC boasts several distinctive features that make it a preferred option for complex electronic systems. Its 9Mbit storage capacity is complemented by a parallel interface, allowing for fast data access and high throughput. The device's integration in a 256FBGA package ensures minimized space usage and enhanced performance in compact systems. Furthermore, its operational efficiency is maintained across a broad range of temperatures, making it suitable for industrial applications prone to varying environmental conditions.

CYD09S36V18-167BBXC Applications

  • Networking Equipment: Utilized in routers and switches, where fast and reliable data buffering is necessary to handle high-speed network traffic efficiently.
  • Industrial Automation: Integrated in control systems that require rapid access to data for real-time process control and monitoring in manufacturing environments.
  • Telecommunications: Employed in telecommunications infrastructure to provide high-speed cache memory that enhances the performance and reliability of communication systems.
  • Aerospace and Defense: Used in applications requiring robust memory solutions that can perform under extreme conditions without compromising data integrity or speed.
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