CYD09S36V18-167BBXC
- Mfr.Part #
- CYD09S36V18-167BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 256FBGA
- Stock
- 49,060
- In Stock :
- 49,060
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Terminal Position :
- BOTTOM
- Memory Format :
- SRAM
- Output Characteristics :
- 3-STATE
- Height Seated (Max) :
- 1.7mm
- Mounting Type :
- Surface Mount
- Radiation Hardening :
- No
- JESD-609 Code :
- e1
- Package / Case :
- 256-LBGA
- Mount :
- Surface Mount
- Length :
- 17mm
- Address Bus Width :
- 18b
- Sync/Async :
- SYNCHRONOUS
- Memory Type :
- Volatile
- Memory Width :
- 36
- Memory Size :
- 9Mb 256K x 36
- Pbfree Code :
- yes
- Number of Pins :
- 256
- Published :
- 2006
- Packaging :
- Tray
- Supply Voltage :
- 1.5V
- Lead Free :
- Lead Free
- Operating Temperature :
- 0°C~70°C TA
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Peak Reflow Temperature (Cel) :
- 260
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
- I/O Type :
- COMMON
- Base Part Number :
- CYD09S36
- Operating Supply Voltage :
- 1.8V
- Factory Lead Time :
- 15 Weeks
- Number of Functions :
- 1
- Number of Terminations :
- 256
- Nominal Supply Current :
- 570mA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Access Time :
- 4ns
- Terminal Pitch :
- 1mm
- Memory Interface :
- Parallel
- Word Size :
- 36b
- Standby Voltage-Min :
- 1.4V
- Pin Count :
- 256
- Number of Ports :
- 2
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage-Max (Vsup) :
- 1.58V
- Density :
- 9 Mb
- Clock Frequency :
- 167MHz
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- CYD09S36V18-167BBXC

Memory Infineon Technologies CYD09S36V18-167BBXC Overview
The Memory Infineon Technologies CYD09S36V18-167BBXC is a high-performance 9Mbit SRAM component designed by Infineon Technologies. It is housed in a compact 256FBGA package, enabling dense integration while maintaining a small footprint suitable for a variety of demanding applications. This SRAM device provides robust parallel interfacing, making it ideal for high-speed, high-bandwidth applications where rapid access to data is critical. The Memory Infineon Technologies CYD09S36V18-167BBXC supports a wide range of operating temperatures, ensuring reliability and stability in diverse environmental conditions. This makes it an exemplary choice for businesses looking to invest in top-tier memory solutions that offer both performance and durability.
CYD09S36V18-167BBXC Features
The CYD09S36V18-167BBXC boasts several distinctive features that make it a preferred option for complex electronic systems. Its 9Mbit storage capacity is complemented by a parallel interface, allowing for fast data access and high throughput. The device's integration in a 256FBGA package ensures minimized space usage and enhanced performance in compact systems. Furthermore, its operational efficiency is maintained across a broad range of temperatures, making it suitable for industrial applications prone to varying environmental conditions.
CYD09S36V18-167BBXC Applications
- Networking Equipment: Utilized in routers and switches, where fast and reliable data buffering is necessary to handle high-speed network traffic efficiently.
- Industrial Automation: Integrated in control systems that require rapid access to data for real-time process control and monitoring in manufacturing environments.
- Telecommunications: Employed in telecommunications infrastructure to provide high-speed cache memory that enhances the performance and reliability of communication systems.
- Aerospace and Defense: Used in applications requiring robust memory solutions that can perform under extreme conditions without compromising data integrity or speed.
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