CYD09S18V18-200BBXC
- Mfr.Part #
- CYD09S18V18-200BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 256FBGA
- Stock
- 41,406
- In Stock :
- 41,406
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- JESD-30 Code :
- S-PBGA-B256
- Terminal Finish :
- TIN SILVER COPPER
- Supply Voltage :
- 1.5V
- Memory Format :
- SRAM
- Number of Functions :
- 1
- Memory Size :
- 9Mb 512K x 18
- Memory Density :
- 9437184 bit
- Pin Count :
- 256
- Surface Mount :
- yes
- Packaging :
- Tray
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Package / Case :
- 256-LBGA
- Number of Terminations :
- 256
- JESD-609 Code :
- e1
- Qualification Status :
- COMMERCIAL
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Position :
- BOTTOM
- Pbfree Code :
- yes
- Memory Interface :
- Parallel
- Memory Type :
- Volatile
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
- Access Time :
- 3.3ns
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Supply Voltage-Max (Vsup) :
- 1.58V
- Memory Width :
- 18
- Width :
- 17mm
- Length :
- 17mm
- Terminal Pitch :
- 1mm
- Clock Frequency :
- 200MHz
- Organization :
- 512KX18
- Reach Compliance Code :
- Unknown
- Supply Voltage-Min (Vsup) :
- 1.42V
- Operating Temperature :
- 0°C~70°C TA
- Height Seated (Max) :
- 1.7mm
- Datasheets
- CYD09S18V18-200BBXC

Memory Infineon Technologies CYD09S18V18-200BBXC Overview
The Infineon Technologies CYD09S18V18-200BBXC SRAM chip is an essential component for applications demanding high-speed data access and reliability. With a 9Mbit storage capacity, this Memory component is structured in a dense 256FBGA package, ensuring a minimal footprint while maximizing functionality. This SRAM offers stable and rapid data handling capabilities, making it a perfect fit for advanced computing systems that require swift and repeated access to large volumes of data. Its parallel interface ensures compatibility with a wide range of existing technologies, facilitating easier integration. The high-quality engineering by Infineon Technologies guarantees performance reliability and durability, appealing to B2B customers looking to purchase in bulk for high-demand systems.
CYD09S18V18-200BBXC Features
This high-performance SRAM chip boasts several features that make it stand out:
- 9Mbit storage capacity for handling substantial amounts of data.
- Parallel interface, providing quick data access speeds.
- Compact 256FBGA packaging, optimizing space without compromising on performance.
- Designed for high reliability and stability under varying operating conditions.
CYD09S18V18-200BBXC Applications
- Advanced Computing Systems: Provides rapid access to data, crucial for high-performance CPUs and GPUs.
- Networking Hardware: Enhances data flow management in routers and switches ensuring efficient network traffic handling.
- Telecommunications Equipment: Integral for fast and reliable data storage in telecom infrastructures, supporting robust communication protocols.
- Industrial Automation: Facilitates high-speed data access necessary for control units in automated manufacturing lines.
- Aerospace and Defense: Suitable for applications requiring robust, reliable memory storage under extreme conditions.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















