CYD09S18V18-200BBXC

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Mfr.Part #
CYD09S18V18-200BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 256FBGA
Stock
41,406
In Stock :
41,406

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
JESD-30 Code :
S-PBGA-B256
Terminal Finish :
TIN SILVER COPPER
Supply Voltage :
1.5V
Memory Format :
SRAM
Number of Functions :
1
Memory Size :
9Mb 512K x 18
Memory Density :
9437184 bit
Pin Count :
256
Surface Mount :
yes
Packaging :
Tray
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Package / Case :
256-LBGA
Number of Terminations :
256
JESD-609 Code :
e1
Qualification Status :
COMMERCIAL
Peak Reflow Temperature (Cel) :
260
Terminal Position :
BOTTOM
Pbfree Code :
yes
Memory Interface :
Parallel
Memory Type :
Volatile
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Access Time :
3.3ns
Time@Peak Reflow Temperature-Max (s) :
20
Supply Voltage-Max (Vsup) :
1.58V
Memory Width :
18
Width :
17mm
Length :
17mm
Terminal Pitch :
1mm
Clock Frequency :
200MHz
Organization :
512KX18
Reach Compliance Code :
Unknown
Supply Voltage-Min (Vsup) :
1.42V
Operating Temperature :
0°C~70°C TA
Height Seated (Max) :
1.7mm
Introducing Memory Infineon Technologies CYD09S18V18-200BBXC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:256-LBGA, Number of Terminations:256, Operating Temperature:0°C~70°C TA, CYD09S18V18-200BBXC pinout, CYD09S18V18-200BBXC datasheet PDF, CYD09S18V18-200BBXC amp .Beyond Memory Infineon Technologies CYD09S18V18-200BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD09S18V18-200BBXC


Memory Infineon Technologies CYD09S18V18-200BBXC Overview

The Infineon Technologies CYD09S18V18-200BBXC SRAM chip is an essential component for applications demanding high-speed data access and reliability. With a 9Mbit storage capacity, this Memory component is structured in a dense 256FBGA package, ensuring a minimal footprint while maximizing functionality. This SRAM offers stable and rapid data handling capabilities, making it a perfect fit for advanced computing systems that require swift and repeated access to large volumes of data. Its parallel interface ensures compatibility with a wide range of existing technologies, facilitating easier integration. The high-quality engineering by Infineon Technologies guarantees performance reliability and durability, appealing to B2B customers looking to purchase in bulk for high-demand systems.

CYD09S18V18-200BBXC Features

This high-performance SRAM chip boasts several features that make it stand out:

  • 9Mbit storage capacity for handling substantial amounts of data.
  • Parallel interface, providing quick data access speeds.
  • Compact 256FBGA packaging, optimizing space without compromising on performance.
  • Designed for high reliability and stability under varying operating conditions.

CYD09S18V18-200BBXC Applications

  • Advanced Computing Systems: Provides rapid access to data, crucial for high-performance CPUs and GPUs.
  • Networking Hardware: Enhances data flow management in routers and switches ensuring efficient network traffic handling.
  • Telecommunications Equipment: Integral for fast and reliable data storage in telecom infrastructures, supporting robust communication protocols.
  • Industrial Automation: Facilitates high-speed data access necessary for control units in automated manufacturing lines.
  • Aerospace and Defense: Suitable for applications requiring robust, reliable memory storage under extreme conditions.
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Shipping Method

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Shipping Cost

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