XPC850VR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Halogen Free :

Not Halogen Free

Number of Pins :

256

External Data Bus Width :

32

Integrated Cache :

yes

Height Seated (Max) :

2.35mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

JESD-609 Code :

e1

Format :

FIXED POINT

Number of Terminations :

256

Core Architecture :

PowerPC

Frequency :

50MHz

Surface Mount :

yes

Length :

23mm

RoHS Status :

RoHS Compliant

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Position :

BOTTOM

Peak Reflow Temperature (Cel) :

245

Pin Count :

256

Number of Cores :

1

Lead Free :

Lead Free

Low Power Mode :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Width :

23mm

Supply Voltage-Max (Vsup) :

3.465V

Qualification Status :

Not Qualified

Terminal Form :

Ball

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Boundary Scan :

yes

Address Bus Width :

26

Bit Size :

32

Max Operating Temperature :

95°C

RAM Size :

8kB

Min Operating Temperature :

0°C

Supply Voltage :

3.3V