XPC823EZT75BA

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Number of CPU Cores :

1

Supplier Package :

BGA

Lead Shape :

Ball

PCB changed :

256

Graphics Acceleration :

No

Security Features :

-

RAM Controllers :

-

Operating Temperature :

0°C ~ 95°C (TJ)

Ethernet :

10Mbps (1)

Package Width :

23

ECCN (US) :

3A991.A.2

Package Length :

23

Maximum Operating Temperature (°C) :

95

RoHS Status :

RoHS non-compliant

Supplier Device Package :

256-PBGA (23x23)

Standard Package Name :

BGA

Pin Count :

256

Package :

Bulk

Series :

-

Package Height :

1.84(Max)

I/O Voltage (V) :

3.3

Speed :

75MHz

Instruction Set Architecture :

RISC

Core Processor :

PowerPC

HTS :

8542.31.00.01

Mounting :

Surface Mount

Minimum Operating Temperature (°C) :

0

Number of Cores/Bus Width :

1 Core, 32-Bit

Voltage - I/O :

3.3V

Packaging :

Tray

Data Bus Width (bit) :

32

Product Status :

Obsolete

Package / Case :

256-BBGA

Co-Processors/DSP :

Communications; RISC CPM

SATA :

-

Device Core :

PowerPC

Maximum Speed (MHz) :

75

Display & Interface Controllers :

LCD, Video

Family Name :

PowerPC MPC8xx Processor

USB :

USB 1.x (1)

Additional Interfaces :

I²C, SMC, SCC, SPI, UART