XPC850SRZT80BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Qualification Status :

Not Qualified

Format :

FIXED POINT

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Bit Size :

32

Peak Reflow Temperature (Cel) :

220

Max Operating Temperature :

95°C

Power Supplies :

3.3V

Surface Mount :

yes

Time@Peak Reflow Temperature-Max (s) :

30

JESD-609 Code :

e0

Terminal Finish :

TIN LEAD

Integrated Cache :

yes

Lead Free :

Contains Lead

Boundary Scan :

yes

External Data Bus Width :

32

Supply Voltage-Max (Vsup) :

3.465V

Low Power Mode :

yes

RoHS Status :

RoHS Compliant

Number of Cores :

1

Height Seated (Max) :

2.35mm

Width :

23mm

Terminal Form :

Ball

Length :

23mm

Number of Terminations :

256

Frequency :

80MHz

Halogen Free :

Not Halogen Free

Supply Voltage :

3.3V

Terminal Position :

BOTTOM

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Min Operating Temperature :

0°C

Package / Case :

BGA

Address Bus Width :

26

Pin Count :

256