XPC850DSLVR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Integrated Cache :

yes

Pin Count :

256

Halogen Free :

Not Halogen Free

Address Bus Width :

26

Core Architecture :

PowerPC

Qualification Status :

Not Qualified

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

30

Number of Cores :

1

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Height Seated (Max) :

2.35mm

Number of Pins :

256

Boundary Scan :

yes

Width :

23mm

Lead Free :

Lead Free

Peak Reflow Temperature (Cel) :

245

JESD-609 Code :

e1

Max Operating Temperature :

95°C

Frequency :

50MHz

Surface Mount :

yes

Number of Terminations :

256

External Data Bus Width :

32

Supply Voltage :

3.3V

Supply Voltage-Max (Vsup) :

3.465V

RoHS Status :

RoHS Compliant

Length :

23mm

Low Power Mode :

yes

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Bit Size :

32

Format :

FIXED POINT

Terminal Position :

BOTTOM

Terminal Form :

Ball

Min Operating Temperature :

0°C