XPC850DSLVR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Frequency :

50MHz

Number of Terminations :

256

Core Architecture :

PowerPC

Height Seated (Max) :

2.35mm

External Data Bus Width :

32

Min Operating Temperature :

0°C

Width :

23mm

Pin Count :

256

Number of Pins :

256

Length :

23mm

Terminal Form :

Ball

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Supply Voltage :

3.3V

Peak Reflow Temperature (Cel) :

245

Supply Voltage-Max (Vsup) :

3.465V

Integrated Cache :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Lead Free :

Lead Free

Max Operating Temperature :

95°C

Bit Size :

32

Low Power Mode :

yes

Surface Mount :

yes

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Boundary Scan :

yes

Number of Cores :

1

Halogen Free :

Not Halogen Free

Format :

FIXED POINT

Address Bus Width :

26

JESD-609 Code :

e1

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Position :

BOTTOM

RoHS Status :

RoHS Compliant

Qualification Status :

Not Qualified