XC6SLX9-2FTG256I
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- Mfr.Part #
- XC6SLX9-2FTG256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 186 I/O 256FTBGA
- Stock
- 11,661
- In Stock ：
- 11,661
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 1.55mm
- Number of Logic Elements/Cells :
- 9152
- Mount :
- Surface Mount
- Operating Temperature :
- -40°C~100°C TJ
- Number of CLBs :
- 715
- Number of I/O :
- 186
- Terminal Position :
- BOTTOM
- ECCN Code :
- EAR99
- Clock Frequency :
- 667MHz
- Base Part Number :
- XC6SLX9
- Packaging :
- Tray
- Package / Case :
- 256-LBGA
- Number of Registers :
- 11440
- Supply Voltage :
- 1.2V
- Peak Reflow Temperature (Cel) :
- 260
- Mounting Type :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- ROHS3 Compliant
- Length :
- 17mm
- JESD-609 Code :
- e1
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 256
- Speed Grade :
- 2
- Qualification Status :
- Not Qualified
- Pbfree Code :
- yes
- Operating Supply Voltage :
- 1.2V
- Terminal Form :
- Ball
- Terminal Pitch :
- 1mm
- Total RAM Bits :
- 589824
- Number of LABs/CLBs :
- 715
- REACH SVHC :
- Unknown
- Series :
- Spartan®-6 LX
- Number of Logic Blocks (LABs) :
- 1430
- Number of Terminations :
- 256
- Factory Lead Time :
- 10 Weeks
- Voltage - Supply :
- 1.14V~1.26V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Pins :
- 256
- Published :
- 2008
- RAM Size :
- 72kB
- Width :
- 17mm
- Number of Outputs :
- 186
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Datasheets
- XC6SLX9-2FTG256I
FPGAs AMD Xilinx XC6SLX9-2FTG256I Overview
The FPGAs AMD Xilinx XC6SLX9-2FTG256I is a high-performance, field-programmable gate array designed to meet the demanding needs of modern digital circuits. Manufactured by AMD Xilinx, this FPGA offers a flexible and efficient solution for a wide range of applications, thanks to its robust feature set and adaptability. With its 256-pin fine-pitch ball grid array (FBGA) packaging, it provides a compact footprint while still delivering substantial I/O capabilities and configuration options. This product is ideal for developers looking to push the boundaries of technology with substantial logic capacity and integrated features for optimized performance.
XC6SLX9-2FTG256I Features
The XC6SLX9-2FTG256I boasts several key features that make it a powerful choice for both prototyping and full-scale production. It includes 186 I/O ports, allowing for versatile connections to a variety of peripherals and other ICs. The FPGA is characterized by its enhanced heat tolerance and reduced power consumption, making it suitable for intensive applications without compromising on efficiency. Additionally, the FPGA's architecture supports rapid prototyping and scalability, making it a versatile tool for engineers and designers.
XC6SLX9-2FTG256I Applications
- Consumer Electronics: Utilized in devices such as smartphones, tablets, and other portable devices, this FPGA can manage multiple functions including signal processing and power management, enhancing device performance and efficiency.
- Automotive Systems: In automotive applications, the XC6SLX9-2FTG256I can be used to control and manage advanced driver-assistance systems (ADAS), infotainment systems, and vehicle-to-vehicle communication, improving safety and user experience.
- Industrial Automation: This FPGA is ideal for industrial automation environments, helping to control machinery, robotic systems, and process management, thus increasing the precision and reliability of industrial operations.
- Medical Devices: In the medical field, the XC6SLX9-2FTG256I contributes to the functionality of diagnostic and therapeutic devices. It enables sophisticated data processing capabilities necessary for imaging technologies and patient monitoring systems.
- Communication Infrastructure: This FPGA supports complex algorithms required for modern communication technologies, facilitating enhanced data transmission capabilities in networking gear and telecommunications equipment.
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