XC6SLX100-2FG676C
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- Mfr.Part #
- XC6SLX100-2FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 480 I/O 676FCBGA
- Stock
- 49,935
- In Stock ：
- 49,935
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Pin Count :
- 676
- Operating Supply Voltage :
- 1.2V
- Speed Grade :
- 2
- Number of LABs/CLBs :
- 7911
- RoHS Status :
- Non-RoHS Compliant
- Voltage - Supply :
- 1.14V~1.26V
- Clock Frequency :
- 667MHz
- Number of Terminations :
- 676
- Number of Registers :
- 126576
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- Spartan®-6 LX
- Mount :
- Surface Mount
- Package / Case :
- 676-BBGA, FCBGA
- Published :
- 2008
- Reach Compliance Code :
- not_compliant
- Packaging :
- Tray
- Contact Plating :
- Lead, Tin
- RAM Size :
- 603kB
- JESD-609 Code :
- e0
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Outputs :
- 480
- Base Part Number :
- XC6SLX100
- Terminal Pitch :
- 1mm
- Number of Logic Elements/Cells :
- 101261
- Qualification Status :
- Not Qualified
- Pbfree Code :
- No
- ECCN Code :
- 3A991.D
- Number of I/O :
- 480
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Peak Reflow Temperature (Cel) :
- 225
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 1.2V
- Number of Pins :
- 676
- Total RAM Bits :
- 4939776
- Factory Lead Time :
- 10 Weeks
- Datasheets
- XC6SLX100-2FG676C
FPGAs AMD Xilinx XC6SLX100-2FG676C Overview
Introducing the FPGAs AMD Xilinx XC6SLX100-2FG676C, a high-performance Field Programmable Gate Array designed by the industry leader AMD Xilinx. This device is tailored for advanced applications requiring flexible hardware configurations with a high density of logic resources. The XC6SLX100-2FG676C boasts a 676-pin flip-chip ball grid array (FCBGA) packaging, making it ideal for robust, compact designs. With its extensive I/O capabilities, it supports a wide array of interfacing options, catering to both complex industrial applications and high-speed data environments.
XC6SLX100-2FG676C Features
The XC6SLX100-2FG676C FPGA features 480 I/O pins, allowing extensive peripheral integrations and flexibility in system design. The device is crafted to support high-speed digital communications, offering a versatile platform for developing sophisticated electronic systems. Its large logic capacity and support for numerous logic blocks enable the creation of highly complex integrated circuits tailored to specific needs and applications.
XC6SLX100-2FG676C Applications
- Telecommunications Equipment: Utilizes its high I/O count and robust configuration options to manage and process high volumes of data, enhancing communication protocols and infrastructure.
- Data Centers: Supports high-speed data processing tasks, optimizing operations in servers and storage systems through efficient data handling and throughput capabilities.
- Aerospace and Defense Systems: Provides the necessary reliability and programmability for mission-critical aerospace applications, including guidance and control systems.
- Medical Imaging Devices: Employs its advanced processing power to handle complex algorithms required in medical diagnostics, improving imaging technologies like MRI and CT scanners.
- Automotive Electronics: Enhances automotive safety and functionality with its capacity to integrate into driver assistance systems and in-vehicle infotainment.
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