XC6SLX100-2FG676C
- Mfr.Part #
- XC6SLX100-2FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 480 I/O 676FCBGA
- Stock
- 49,935
- In Stock :
- 49,935
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Speed Grade :
- 2
- Published :
- 2008
- Base Part Number :
- XC6SLX100
- Peak Reflow Temperature (Cel) :
- 225
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Registers :
- 126576
- Supply Voltage :
- 1.2V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of I/O :
- 480
- Voltage - Supply :
- 1.14V~1.26V
- Reach Compliance Code :
- not_compliant
- Number of Pins :
- 676
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Outputs :
- 480
- Qualification Status :
- Not Qualified
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 10 Weeks
- Contact Plating :
- Lead, Tin
- Series :
- Spartan®-6 LX
- Pin Count :
- 676
- Clock Frequency :
- 667MHz
- RoHS Status :
- Non-RoHS Compliant
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 4939776
- JESD-609 Code :
- e0
- Operating Temperature :
- 0°C~85°C TJ
- Number of Terminations :
- 676
- ECCN Code :
- 3A991.D
- Pbfree Code :
- No
- Packaging :
- Tray
- Operating Supply Voltage :
- 1.2V
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Package / Case :
- 676-BBGA, FCBGA
- RAM Size :
- 603kB
- Mount :
- Surface Mount
- Terminal Pitch :
- 1mm
- Number of LABs/CLBs :
- 7911
- Number of Logic Elements/Cells :
- 101261
- Datasheets
- XC6SLX100-2FG676C

FPGAs AMD Xilinx XC6SLX100-2FG676C Overview
Introducing the FPGAs AMD Xilinx XC6SLX100-2FG676C, a high-performance Field Programmable Gate Array designed by the industry leader AMD Xilinx. This device is tailored for advanced applications requiring flexible hardware configurations with a high density of logic resources. The XC6SLX100-2FG676C boasts a 676-pin flip-chip ball grid array (FCBGA) packaging, making it ideal for robust, compact designs. With its extensive I/O capabilities, it supports a wide array of interfacing options, catering to both complex industrial applications and high-speed data environments.
XC6SLX100-2FG676C Features
The XC6SLX100-2FG676C FPGA features 480 I/O pins, allowing extensive peripheral integrations and flexibility in system design. The device is crafted to support high-speed digital communications, offering a versatile platform for developing sophisticated electronic systems. Its large logic capacity and support for numerous logic blocks enable the creation of highly complex integrated circuits tailored to specific needs and applications.
XC6SLX100-2FG676C Applications
- Telecommunications Equipment: Utilizes its high I/O count and robust configuration options to manage and process high volumes of data, enhancing communication protocols and infrastructure.
- Data Centers: Supports high-speed data processing tasks, optimizing operations in servers and storage systems through efficient data handling and throughput capabilities.
- Aerospace and Defense Systems: Provides the necessary reliability and programmability for mission-critical aerospace applications, including guidance and control systems.
- Medical Imaging Devices: Employs its advanced processing power to handle complex algorithms required in medical diagnostics, improving imaging technologies like MRI and CT scanners.
- Automotive Electronics: Enhances automotive safety and functionality with its capacity to integrate into driver assistance systems and in-vehicle infotainment.
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