XC6SLX100-2FG676I

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Mfr.Part #
XC6SLX100-2FG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 480 I/O 676FCBGA
Stock
2
In Stock :
2

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Qualification Status :
Not Qualified
RAM Size :
603kB
Clock Frequency :
667MHz
Terminal Finish :
Tin/Lead (Sn63Pb37)
Terminal Position :
BOTTOM
Number of Registers :
126576
ECCN Code :
3A991.D
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Voltage - Supply :
1.14V~1.26V
Mount :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Number of Terminations :
676
Supply Voltage :
1.2V
Time@Peak Reflow Temperature-Max (s) :
30
Number of LABs/CLBs :
7911
Series :
Spartan®-6 LX
Pbfree Code :
No
Speed Grade :
2
Terminal Form :
Ball
Number of Outputs :
480
JESD-609 Code :
e0
Operating Supply Voltage :
1.2V
Published :
2008
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
480
Packaging :
Tray
Mounting Type :
Surface Mount
Number of Pins :
676
Base Part Number :
XC6SLX100
Peak Reflow Temperature (Cel) :
225
Pin Count :
676
Terminal Pitch :
1mm
Number of Logic Elements/Cells :
101261
Factory Lead Time :
10 Weeks
Operating Temperature :
-40°C~100°C TJ
Total RAM Bits :
4939776
Package / Case :
676-BBGA, FCBGA
Datasheets
XC6SLX100-2FG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX100-2FG676I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Mounting Type:Surface Mount, Number of Pins:676, Base Part Number:XC6SLX100, Operating Temperature:-40°C~100°C TJ, Package / Case:676-BBGA, FCBGA, XC6SLX100-2FG676I pinout, XC6SLX100-2FG676I datasheet PDF, XC6SLX100-2FG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX100-2FG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX100-2FG676I


FPGAs AMD Xilinx XC6SLX100-2FG676I Overview

The AMD Xilinx XC6SLX100-2FG676I is a highly capable FPGA (Field Programmable Gate Array) designed to meet the rigorous demands of modern digital applications. Known for its flexibility and performance, this device allows for on-the-fly reprogramming and customization, which is essential for adapting to new standards and technologies. Featuring a dense layout of 480 I/O pins encapsulated in a 676FCBGA package, the XC6SLX100-2FG676I offers robust support for a wide range of functionalities, making it an ideal choice for developers looking to push the boundaries of hardware acceleration and signal processing.

XC6SLX100-2FG676I Features

This FPGA excels in providing a scalable architecture that can cater to varying levels of processing needs. Key features include a high-density logic gate configuration, substantial memory resources, advanced clock management systems, and comprehensive power management controls. These features collectively ensure optimal performance and reliability, suitable for intensive computing environments.

XC6SLX100-2FG676I Applications

  • Telecommunications: Utilized in networking equipment to manage data flow and signal processing, enhancing the efficiency and speed of network communications.
  • Automotive: Employed in driver assistance systems where rapid signal processing is essential for real-time decision making and vehicle safety enhancements.
  • Consumer Electronics: Integral to multimedia devices, providing the necessary processing power for high-definition video rendering and complex digital audio systems.
  • Industrial Automation: Serves as the backbone for control systems in automated production lines, improving operational precision and machine coordination.
  • Aerospace and Defense: Crucial in the development of avionics and radar systems, where robust and adaptable processing capabilities are required for mission-critical operations.
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