X66AK2H12AAAWA2
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- Mfr.Part #
- X66AK2H12AAAWA2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 9,828
- In Stock ：
- 9,828
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Base Part Number :
- 66AK2H12
- Pbfree Code :
- No
- On Chip Data RAM :
- 12.75MB
- Integrated Cache :
- yes
- Memory Type :
- SRAM
- Number of Pins :
- 1517
- Package / Case :
- 1517-BBGA, FCBGA
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Lead Free :
- Contains Lead
- Terminal Pitch :
- 1mm
- RoHS Status :
- Non-RoHS Compliant
- Format :
- Floating Point
- Type :
- DSP+ARM®
- Boundary Scan :
- yes
- Height Seated (Max) :
- 3.75mm
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature :
- -40°C~100°C TC
- Frequency :
- 1.2GHz
- Series :
- 66AK2Hx KeyStone Multicore
- Voltage - Core :
- Variable
- Length :
- 40mm
- Number of Timers/Counters :
- 20
- External Data Bus Width :
- 16
- Mounting Type :
- Surface Mount
- RAM Size :
- 512kB
- Low Power Mode :
- yes
- HTS Code :
- 8542.31.00.01
- Core Architecture :
- ARM
- Min Supply Voltage :
- 902mV
- Address Bus Width :
- 24
- Supply Voltage :
- 1V
- Terminal Position :
- BOTTOM
- Width :
- 40mm
- Mount :
- Surface Mount
- ECCN Code :
- 3A001.A.3
- Terminal Form :
- Ball
- Packaging :
- Tray
- Non-Volatile Memory :
- ROM (384kB)
- Datasheets
- X66AK2H12AAAWA2
DSP Texas Instruments X66AK2H12AAAWA2 Overview
The DSP Texas Instruments X66AK2H12AAAWA2 is a highly integrated and advanced digital signal processor (DSP) designed by Texas Instruments, renowned for its robust performance and versatility in processing digital signals in real-time. This IC is engineered to handle complex computations and data-intensive applications, making it an ideal choice for developers looking to implement sophisticated signal processing capabilities in their designs. With its high integration, this SOC (System on Chip) minimizes the need for additional components, facilitating a more compact and efficient system design.
X66AK2H12AAAWA2 Features
This powerful SOC incorporates a range of features that enhance its efficiency and functionality. It includes advanced ARM architecture, which provides a balance of power and energy efficiency, making it suitable for portable and power-sensitive applications. The BGA (Ball Grid Array) packaging ensures a reliable connection and improved thermal management, which is crucial for maintaining performance in rigorous conditions. Additionally, the DSP capabilities allow for superior audio, video, and other signal processing tasks, further enhancing its application range.
X66AK2H12AAAWA2 Applications
- Automotive Audio Systems: The X66AK2H12AAAWA2 can be used to enhance audio processing capabilities in automotive systems, ensuring high-quality sound reproduction and advanced noise cancellation techniques.
- Wireless Communication Devices: With its efficient signal processing capabilities, this IC helps in the management and enhancement of wireless signals, aiding in clearer communication and better data transmission reliability.
- Medical Imaging Systems: The high processing power of the X66AK2H12AAAWA2 makes it suitable for medical imaging applications, where it processes complex algorithms to create detailed and accurate imaging outputs.
- Consumer Electronics: Employed in devices such as smartphones and tablets, this DSP improves multimedia experiences through enhanced video and audio processing capabilities.
- Industrial Control Systems: This processor can also be applied in industrial environments to control and manage machine operations, ensuring efficient and precise automation.
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