X66AK2H06AAW2
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- Mfr.Part #
- X66AK2H06AAW2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 17,271
- In Stock ：
- 17,271
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Mount :
- Surface Mount
- Type :
- DSP+ARM®
- Lead Free :
- Contains Lead
- Packaging :
- Tray
- Package / Case :
- 1517-BBGA, FCBGA
- Low Power Mode :
- yes
- RoHS Status :
- Non-RoHS Compliant
- Non-Volatile Memory :
- ROM (384kB)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Memory Size :
- 4MB
- Length :
- 38mm
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Frequency :
- 1.2GHz
- Min Supply Voltage :
- 800mV
- Mounting Type :
- Surface Mount
- Series :
- 66AK2Hx KeyStone Multicore
- Width :
- 38mm
- Integrated Cache :
- yes
- Boundary Scan :
- yes
- Number of UART Channels :
- 2
- Supply Voltage :
- 1V
- RAM Size :
- 32kB
- JESD-30 Code :
- S-PBGA-B1517
- Core Architecture :
- ARM
- Pbfree Code :
- No
- ECCN Code :
- 3A001.A.3
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Height :
- 800μm
- Base Part Number :
- 66AK2H06
- Max Supply Voltage :
- 1.1V
- Number of Timers/Counters :
- 20
- Voltage - Core :
- Variable
- Terminal Form :
- Ball
- Operating Temperature :
- 0°C~85°C TC
- On Chip Data RAM :
- 8.375MB
- Format :
- Floating Point
- Number of I/O :
- 32
- Datasheets
- X66AK2H06AAW2
DSP Texas Instruments X66AK2H06AAW2 Overview
The DSP Texas Instruments X66AK2H06AAW2 is a highly capable digital signal processor (DSP) that serves as an integral component in sophisticated electronics. Designed and manufactured by Texas Instruments, a leader in semiconductor innovation, this IC leverages advanced ARM SOC architecture, housed in a BGA package, to deliver superior performance and reliability. This product is tailored for applications requiring intense computational power and real-time processing, making it an ideal choice for developers and manufacturers aiming to enhance their high-performance systems.
X66AK2H06AAW2 Features
This DSP from Texas Instruments incorporates a robust set of features to tackle the most demanding processing tasks. The ARM SOC architecture allows for efficient multitasking and high-speed data processing, which is critical in modern electronic devices. The BGA packaging ensures a compact footprint while providing enhanced thermal management, crucial for maintaining system stability and prolonging the lifecycle of the product. Furthermore, the integration of multiple communication interfaces supports a wide range of connectivity options, enhancing its versatility in various applications.
X66AK2H06AAW2 Applications
- Automotive Advanced Driver-Assistance Systems (ADAS): Utilizes real-time signal processing capabilities to interpret and react to environmental data, improving vehicle safety and functionality.
- Medical Imaging Systems: Employs complex algorithms to process medical images rapidly, aiding in faster and more accurate diagnostic procedures.
- Wireless Communication Systems: Enhances signal integrity and speed in high-frequency wireless communication devices.
- Audio Processing Units: Provides high fidelity and low-latency audio signal processing for both professional and consumer-grade audio equipment.
- Industrial Automation: Supports robust, real-time control systems necessary for automated manufacturing processes.
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