X66AK2H06AAAWA24
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- Mfr.Part #
- X66AK2H06AAAWA24
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 16,476
- In Stock ：
- 16,476
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Package / Case :
- 1517-BBGA, FCBGA
- Type :
- DSP+ARM®
- Lead Free :
- Contains Lead
- Format :
- Floating Point
- On Chip Data RAM :
- 8.375MB
- Number of Pins :
- 1517
- Max Supply Voltage :
- 997mV
- Height Seated (Max) :
- 3.75mm
- Operating Supply Voltage :
- 950mV
- Terminal Position :
- BOTTOM
- Data Bus Width :
- 32b
- RAM Size :
- 6MB
- Clock Rate :
- 1.2GHz DSP, 1.4GHz ARM®
- Packaging :
- Tray
- Supply Voltage :
- 1V
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Series :
- 66AK2Hx KeyStone Multicore
- Address Bus Width :
- 24
- Core Architecture :
- ARM
- RoHS Status :
- Non-RoHS Compliant
- Base Part Number :
- 66AK2H06
- Mount :
- Surface Mount
- Additional Feature :
- ALSO OPERATES AT 1200 GHZ
- Integrated Cache :
- yes
- Length :
- 40mm
- Terminal Pitch :
- 1mm
- Min Supply Voltage :
- 902mV
- Pbfree Code :
- No
- Boundary Scan :
- yes
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Low Power Mode :
- yes
- Terminal Form :
- Ball
- Radiation Hardening :
- No
- Frequency :
- 1.4GHz
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Timers/Counters :
- 14
- Voltage - Core :
- Variable
- Non-Volatile Memory :
- ROM (384kB)
- Operating Temperature :
- -40°C~100°C TC
- Datasheets
- X66AK2H06AAAWA24
DSP Texas Instruments X66AK2H06AAAWA24 Overview
The DSP Texas Instruments X66AK2H06AAAWA24 is a highly integrated digital signal processor (DSP) designed for advanced applications that require robust processing capabilities. This IC DSP ARM SOC BGA from Texas Instruments excels in delivering high-performance signal processing with its ARM architecture, making it an ideal choice for demanding embedded applications. The integration of DSP with ARM SOC in a BGA package allows for compact and efficient designs, facilitating better thermal management and reduced footprint on PCBs. Its versatility is suited for a range of industrial, automotive, and communication applications, emphasizing its capability to handle complex algorithms and data-intensive tasks.
X66AK2H06AAAWA24 Features
This SOC features an advanced ARM processor core integrated with powerful digital signal processing capabilities. The combination provides exceptional computational speed and efficiency, suitable for handling complex signal processing tasks seamlessly. The BGA packaging ensures high-density mounting and excellent thermal properties, which are critical for maintaining reliability and performance in rigorous environments. Moreover, its low power consumption makes it an energy-efficient choice for sustained operations.
X66AK2H06AAAWA24 Applications
- Automotive Systems: Utilized in advanced driver-assistance systems (ADAS) to process real-time data from sensors and cameras, enhancing vehicle safety and functionality.
- Industrial Automation: Powers control systems for machinery and production lines, optimizing performance through fast and accurate signal processing.
- Telecommunications: Integral in communication infrastructure, facilitating signal processing tasks for data transmission and reception with high reliability.
- Medical Devices: Employed in medical imaging systems such as ultrasound and MRI to process complex visual data for diagnostics.
- Consumer Electronics: Supports features in high-end audio and video devices, ensuring high-quality output through efficient signal processing.
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