S29PL032J55BFI123

Manufacturer :

Infineon Technologies

Product Category :

Memory

Boot Block :

BOTTOM/TOP

Supply Voltage :

3V

Command User Interface :

yes

Memory Width :

16

Width :

6.15mm

Number of Functions :

1

Page Size :

8words

JESD-609 Code :

e1

Memory Size :

32Mb 2M x 16

Series :

PL-J

Number of Pins :

48

Surface Mount :

yes

Memory Density :

33554432 bit

Ready/Busy :

yes

Operating Mode :

ASYNCHRONOUS

Number of Sectors/Size :

1662

Peak Reflow Temperature (Cel) :

260

ECCN Code :

3A991.B.1.A

Power Supplies :

3/3.3V

Voltage - Supply :

2.7V~3.6V

Terminal Position :

BOTTOM

Sector Size :

4K32K

Supply Voltage-Max (Vsup) :

3.6V

Length :

8.15mm

Number of Terminations :

48

Terminal Pitch :

0.8mm

Supply Voltage-Min (Vsup) :

2.7V

Common Flash Interface :

yes

Supply Current-Max :

0.07mA

Access Time (Max) :

55 ns

Operating Temperature :

-40°C~85°C TA

Packaging :

Tape and Reel (TR)

Mounting Type :

Surface Mount

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

HTS Code :

8542.32.00.51

Standby Current-Max :

0.000005A

Programming Voltage :

3V

Write Cycle Time - Word, Page :

55ns

Data Polling :

yes

Memory Interface :

Parallel

Published :

2015

Toggle Bit :

yes

Qualification Status :

Not Qualified

Package / Case :

48-VFBGA

Organization :

2MX16

Memory Type :

Non-Volatile

Height Seated (Max) :

1mm

Memory Format :

Flash

Additional Feature :

TOP AND BOTTOM BOOT BLOCK

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

RoHS Status :

ROHS3 Compliant

Time@Peak Reflow Temperature-Max (s) :

40