S29PL032J55BFI122

Manufacturer :

Infineon Technologies

Product Category :

Memory

Packaging :

Tape and Reel (TR)

Memory Format :

Flash

Height Seated (Max) :

1mm

RoHS Status :

ROHS3 Compliant

Time@Peak Reflow Temperature-Max (s) :

40

Memory Type :

Non-Volatile

Command User Interface :

yes

Programming Voltage :

3V

Terminal Position :

BOTTOM

Number of Terminations :

48

Common Flash Interface :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Memory Size :

32Mb 2M x 16

Boot Block :

BOTTOM/TOP

Factory Lead Time :

6 Weeks

Surface Mount :

yes

Supply Voltage-Min (Vsup) :

2.7V

Operating Temperature :

-40°C~85°C TA

Package / Case :

48-VFBGA

Memory Width :

16

Additional Feature :

TOP AND BOTTOM BOOT BLOCK

Ready/Busy :

yes

Standby Current-Max :

0.000005A

Mounting Type :

Surface Mount

Length :

8.15mm

Page Size :

8words

Power Supplies :

3/3.3V

Toggle Bit :

yes

Supply Current-Max :

0.07mA

Supply Voltage :

3V

Sector Size :

4K32K

Published :

2009

Series :

PL-J

Peak Reflow Temperature (Cel) :

260

Memory Density :

33554432 bit

Supply Voltage-Max (Vsup) :

3.6V

Data Polling :

yes

Number of Sectors/Size :

1662

Number of Pins :

48

Organization :

2MX16

Access Time (Max) :

55 ns

HTS Code :

8542.32.00.51

Width :

6.15mm

ECCN Code :

3A991.B.1.A

Qualification Status :

Not Qualified

Voltage - Supply :

2.7V~3.6V

Write Cycle Time - Word, Page :

55ns

Operating Mode :

ASYNCHRONOUS

Number of Functions :

1

Terminal Pitch :

0.8mm

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Memory Interface :

Parallel

JESD-609 Code :

e1