PIC16F777-E/ML

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Mfr.Part #
PIC16F777-E/ML
Manufacturer
Microchip Technology
Package / Case
44-VQFN Exposed Pad
Datasheet
Download
Description
IC MCU 8BIT 14KB FLASH 44QFN
Stock
5,266
In Stock :
5,266

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Interface :
I2C, SPI, UART, USART
DAC Channels :
No
Mounting Type :
Surface Mount
Program Memory Size :
14KB 8K x 14
Supply Voltage :
5V
Data Bus Width :
8B
Lead Free :
Lead Free
Base Part Number :
PIC16F777
Radiation Hardening :
No
Published :
1997
Supply Current-Max :
5mA
Pin Count :
44
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
EEPROM Size :
--
Surface Mount :
yes
Number of I/O :
36
Supplier Device Package :
44-QFN (8x8)
Operating Temperature :
-40°C~125°C TA
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Core Size :
8-Bit
CPU Family :
PIC
Height Seated (Max) :
1mm
DMA Channels :
No
Access Time :
20 μs
Peripherals :
Brown-out Detect/Reset, POR, PWM, WDT
Terminal Position :
QUAD
Number of Timers/Counters :
8
Has ADC :
yes
Terminal Finish :
Matte Tin (Sn)
Speed :
20MHz
Package :
Tube
Data Converter :
A/D 14x10b
Watchdog Timer :
yes
Number of Terminations :
44
Core Processor :
PIC
PWM Channels :
yes
RAM Size :
368 x 8
Memory Size :
14kB
Time@Peak Reflow Temperature-Max (s) :
40
Power Supplies :
2/5.5V
Oscillator Type :
Internal
Frequency :
20MHz
Bit Size :
8
Supply Voltage-Min (Vsup) :
4V
Terminal Pitch :
0.65mm
Data Converters :
A/D 14x10b
Voltage - Supply (Vcc/Vdd) :
4V~5.5V
Series :
PIC® 16F
Product Status :
Obsolete
On Chip Program ROM Width :
14
Program Memory Type :
Flash
JESD-30 Code :
S-PQCC-N44
Package / Case :
44-VQFN Exposed Pad
JESD-609 Code :
e3
Base Product Number :
PIC16F777
Packaging :
Tube
Connectivity :
I2C, SPI, UART/USART
Pbfree Code :
yes
Peak Reflow Temperature (Cel) :
260
RoHS Status :
ROHS3 Compliant
Supply Voltage-Max (Vsup) :
5.5V
Datasheets
PIC16F777-E/ML
Introducing Microcontrollers Microchip Technology PIC16F777-E/ML from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:PIC16F777, Operating Temperature:-40°C~125°C TA, Number of Terminations:44, Package / Case:44-VQFN Exposed Pad, PIC16F777-E/ML pinout, PIC16F777-E/ML datasheet PDF, PIC16F777-E/ML amp .Beyond Microcontrollers Microchip Technology PIC16F777-E/ML ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC16F777-E/ML


Microcontrollers Microchip Technology PIC16F777-E/ML Overview

Introducing the robust PIC16F777-E/ML microcontroller by Microchip Technology, designed for advanced applications requiring a combination of low power consumption and high performance in a compact form factor. This versatile 8-bit microcontroller integrates 14KB of flash memory, offering substantial space for complex firmware development and data storage. Ideal for scalable solutions in industrial and consumer applications, the PIC16F777-E/ML provides a reliable platform for designers aiming to build efficient and innovative systems. Equipped with a rich set of peripherals, it supports a broad range of functionalities, making it a prime choice for developers looking to push the boundaries of embedded technology.

PIC16F777-E/ML Features

The PIC16F777-E/ML microcontroller is packed with features designed to facilitate complex digital and analog functionalities. These include an enhanced mid-range core with 35 instructions, 14KB of flash memory, 368 bytes of EEPROM, and 1KB of RAM. It also supports advanced communication protocols such as SPI, USART, and I²C, along with 10-bit analog-to-digital converters, and several capture/compare/PWM functionalities. The device operates at a voltage range of 2.0 to 5.5 volts, accommodating diverse power setups and ensuring energy efficiency across applications.

PIC16F777-E/ML Applications

  • Consumer Electronics: Utilized in smart home devices such as thermostats and remote controls, where its low power consumption and high functionality allow for sophisticated user interfaces and connectivity features.
  • Automotive: Applied in automotive embedded systems, especially for engine management and infotainment systems that require robust operation under varying environmental conditions.
  • Industrial Automation: Ideal for use in automation controllers and monitoring systems, providing reliable operation and interfacing capabilities in complex industrial environments.
  • Healthcare: Used in medical monitoring devices, where precision and reliability are paramount for patient care and data accuracy.
  • Telecommunications: Helps in the development of telecommunication infrastructure equipment, offering the necessary processing power and connectivity options for network management and optimization.
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