MPC755BVT300LE

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Operating Temperature :

0°C~105°C TA

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Supply Voltage :

2V

Number of Cores/Bus Width :

1 Core 32-Bit

Supply Voltage-Min (Vsup) :

1.8V

Format :

Floating Point

Surface Mount :

yes

Clock Frequency :

100MHz

Bit Size :

32

Peak Reflow Temperature (Cel) :

260

Length :

25mm

Base Part Number :

MPC755

Published :

2001

JESD-30 Code :

S-PBGA-B360

Additional Feature :

ALSO REQUIRES 2.5V OR 3.3V SUPPLY

Packaging :

Tray

Terminal Position :

BOTTOM

Package / Case :

360-BBGA, FCBGA

RoHS Status :

ROHS3 Compliant

Terminal Pitch :

1.27mm

Terminal Finish :

TIN COPPER/TIN SILVER

Terminal Form :

Ball

HTS Code :

8542.31.00.01

Time@Peak Reflow Temperature-Max (s) :

40

Low Power Mode :

yes

Height Seated (Max) :

2.77mm

Voltage - I/O :

2.5V 3.3V

Supply Voltage-Max (Vsup) :

2.1V

Number of Terminations :

360

Speed :

300MHz

JESD-609 Code :

e2

Series :

MPC7xx

External Data Bus Width :

64

Address Bus Width :

32

ECCN Code :

3A991.a.1

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Boundary Scan :

yes

Integrated Cache :

yes

Graphics Acceleration :

No

Core Processor :

PowerPC