MPC755BVT300LE

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Finish :

TIN COPPER/TIN SILVER

Operating Temperature :

0°C~105°C TA

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Integrated Cache :

yes

JESD-30 Code :

S-PBGA-B360

Series :

MPC7xx

Additional Feature :

ALSO REQUIRES 2.5V OR 3.3V SUPPLY

Number of Cores/Bus Width :

1 Core 32-Bit

Peak Reflow Temperature (Cel) :

260

Terminal Pitch :

1.27mm

Supply Voltage :

2V

Clock Frequency :

100MHz

Supply Voltage-Min (Vsup) :

1.8V

Surface Mount :

yes

Package / Case :

360-BBGA, FCBGA

External Data Bus Width :

64

Core Processor :

PowerPC

Number of Terminations :

360

Speed :

300MHz

Supply Voltage-Max (Vsup) :

2.1V

Terminal Form :

Ball

JESD-609 Code :

e2

RoHS Status :

ROHS3 Compliant

ECCN Code :

3A991.a.1

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Height Seated (Max) :

2.77mm

Published :

2001

Boundary Scan :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Bit Size :

32

Address Bus Width :

32

Low Power Mode :

yes

Length :

25mm

Format :

Floating Point

Base Part Number :

MPC755

Packaging :

Tray

Graphics Acceleration :

No

HTS Code :

8542.31.00.01

Terminal Position :

BOTTOM

Voltage - I/O :

2.5V 3.3V