MPC755BPX350LE

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Integrated Cache :

yes

Package / Case :

360-BBGA, FCBGA

Address Bus Width :

32

Terminal Pitch :

1.27mm

Base Part Number :

MPC755

Voltage - I/O :

2.5V 3.3V

Supply Voltage-Max (Vsup) :

2.1V

Graphics Acceleration :

No

Bit Size :

32

HTS Code :

8542.31.00.01

Supply Voltage :

2V

Core Processor :

PowerPC

JESD-609 Code :

e0

External Data Bus Width :

64

Speed :

350MHz

Number of Terminations :

360

ECCN Code :

3A991

Published :

2001

Series :

MPC7xx

Peak Reflow Temperature (Cel) :

245

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

RoHS Status :

Non-RoHS Compliant

Surface Mount :

yes

Low Power Mode :

yes

Packaging :

Tray

Boundary Scan :

yes

Format :

Floating Point

Terminal Finish :

Tin/Lead (Sn/Pb)

Terminal Position :

BOTTOM

Height Seated (Max) :

2.77mm

Number of Cores/Bus Width :

1 Core 32-Bit

Supply Voltage-Min (Vsup) :

1.8V

JESD-30 Code :

S-PBGA-B360

Clock Frequency :

100MHz

Length :

25mm

Operating Temperature :

0°C~105°C TA

Time@Peak Reflow Temperature-Max (s) :

30

Additional Feature :

ALSO REQUIRES 2.5V OR 3.3V SUPPLY

Terminal Form :

Ball