MPC755BPX300LE

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Clock Frequency :

100MHz

Terminal Form :

Ball

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tray

Published :

2001

Terminal Position :

BOTTOM

HTS Code :

8542.31.00.01

Integrated Cache :

yes

Graphics Acceleration :

No

JESD-30 Code :

S-PBGA-B360

ECCN Code :

3A991

Terminal Finish :

Tin/Lead (Sn/Pb)

Height Seated (Max) :

2.77mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Surface Mount :

yes

Number of Terminations :

360

Operating Temperature :

0°C~105°C TA

Length :

25mm

Address Bus Width :

32

Low Power Mode :

yes

External Data Bus Width :

64

Terminal Pitch :

1.27mm

Bit Size :

32

Base Part Number :

MPC755

Boundary Scan :

yes

Core Processor :

PowerPC

RoHS Status :

Non-RoHS Compliant

Time@Peak Reflow Temperature-Max (s) :

30

Voltage - I/O :

2.5V 3.3V

Format :

Floating Point

Package / Case :

360-BBGA, FCBGA

JESD-609 Code :

e0

Supply Voltage-Max (Vsup) :

2.1V

Additional Feature :

ALSO REQUIRES 2.5V OR 3.3V SUPPLY

Number of Cores/Bus Width :

1 Core 32-Bit

Peak Reflow Temperature (Cel) :

245

Speed :

300MHz

Supply Voltage :

2V

Series :

MPC7xx

Supply Voltage-Min (Vsup) :

1.8V