MPC755BPX300LE

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Low Power Mode :

yes

Height Seated (Max) :

2.77mm

Terminal Position :

BOTTOM

Surface Mount :

yes

Supply Voltage-Min (Vsup) :

1.8V

Number of Cores/Bus Width :

1 Core 32-Bit

RoHS Status :

Non-RoHS Compliant

Package / Case :

360-BBGA, FCBGA

Core Processor :

PowerPC

Terminal Pitch :

1.27mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Published :

2001

ECCN Code :

3A991

Address Bus Width :

32

Clock Frequency :

100MHz

Base Part Number :

MPC755

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-609 Code :

e0

Terminal Finish :

Tin/Lead (Sn/Pb)

Format :

Floating Point

Terminal Form :

Ball

Graphics Acceleration :

No

Bit Size :

32

Operating Temperature :

0°C~105°C TA

Integrated Cache :

yes

Packaging :

Tray

HTS Code :

8542.31.00.01

Additional Feature :

ALSO REQUIRES 2.5V OR 3.3V SUPPLY

Series :

MPC7xx

Number of Terminations :

360

Boundary Scan :

yes

Peak Reflow Temperature (Cel) :

245

Supply Voltage :

2V

External Data Bus Width :

64

Voltage - I/O :

2.5V 3.3V

Speed :

300MHz

Length :

25mm

JESD-30 Code :

S-PBGA-B360

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage-Max (Vsup) :

2.1V