MC68MH360VR33L

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Published :

1995

Time@Peak Reflow Temperature-Max (s) :

40

Data Encoding/Decoding Method :

NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL

RAM Controllers :

DRAM

Supply Voltage-Min (Vsup) :

4.75V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Ethernet :

10Mbps (1)

RoHS Status :

ROHS3 Compliant

Surface Mount :

yes

Additional Interfaces :

SCC, SMC, SPI

Co-Processors/DSP :

Communications; CPM

Address Bus Width :

32

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

uPs/uCs/Peripheral ICs Type :

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Number of Terminations :

357

Peak Reflow Temperature (Cel) :

260

Voltage - I/O :

5.0V

Supply Voltage :

5V

Series :

M683xx

Supply Voltage-Max (Vsup) :

5.25V

Speed :

33MHz

Height Seated (Max) :

1.86mm

Package / Case :

357-BBGA

Data Transfer Rate-Max :

1.25 MBps

JESD-30 Code :

S-PBGA-B357

Terminal Pitch :

1.27mm

External Data Bus Width :

32

HTS Code :

8542.31.00.01

Bus Compatibility :

MC68040; MC68030

Clock Frequency :

25MHz

Terminal Position :

BOTTOM

Communication Protocol :

BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP

Base Part Number :

MC68MH360

Number of Cores/Bus Width :

1 Core 32-Bit

Operating Temperature :

0°C~70°C TA

Packaging :

Tray

ECCN Code :

3A991.A.2

Terminal Form :

Ball

Core Processor :

CPU32+

Boundary Scan :

yes

Graphics Acceleration :

No

JESD-609 Code :

e1

Low Power Mode :

yes

Length :

25mm