MC68360ZQ25VL

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Supply Voltage-Max (Vsup) :

5.25V

Time@Peak Reflow Temperature-Max (s) :

40

Boundary Scan :

yes

Graphics Acceleration :

No

Low Power Mode :

yes

RoHS Status :

Non-RoHS Compliant

Operating Temperature :

0°C~70°C TA

JESD-609 Code :

e0

Communication Protocol :

BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP

Voltage - I/O :

3.3V

RAM Controllers :

DRAM

Base Part Number :

MC68360

ECCN Code :

3A991.A.2

Surface Mount :

yes

Package / Case :

357-BBGA

Number of Cores/Bus Width :

1 Core 32-Bit

Terminal Position :

BOTTOM

Speed :

25MHz

Series :

M683xx

External Data Bus Width :

32

JESD-30 Code :

S-PBGA-B357

Ethernet :

10Mbps (1)

Number of Terminations :

357

Core Processor :

CPU32+

Additional Interfaces :

SCC, SMC, SPI

Data Encoding/Decoding Method :

NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL

Supply Voltage :

5V

Length :

25mm

Supply Voltage-Min (Vsup) :

4.75V

HTS Code :

8542.31.00.01

Peak Reflow Temperature (Cel) :

260

Published :

1995

uPs/uCs/Peripheral ICs Type :

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Clock Frequency :

25MHz

Address Bus Width :

32

Terminal Pitch :

1.27mm

Data Transfer Rate-Max :

1.25 MBps

Co-Processors/DSP :

Communications; CPM

Bus Compatibility :

MC68040; MC68030

Packaging :

Tray

Terminal Finish :

Tin/Lead (Sn/Pb)

Terminal Form :

Ball

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

1.86mm