LPC1830FET100Y

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

JESD-30 Code :

S-PBGA-B100

Package / Case :

100-TFBGA

Factory Lead Time :

12 Weeks

Terminal Form :

Ball

PWM Channels :

No

Height Seated (Max) :

1.2mm

Series :

LPC18xx

DAC Channels :

yes

Width :

9mm

Supply Voltage-Max (Vsup) :

3.6V

Published :

2010

Number of Terminations :

100

ROM Programmability :

Flash

Core Processor :

ARM® Cortex®-M3

RAM Size :

200K x 8

Terminal Pitch :

0.8mm

Core Size :

32-Bit

Surface Mount :

yes

Mounting Type :

Surface Mount

Program Memory Type :

ROMless

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Terminal Position :

BOTTOM

Packaging :

Tape and Reel (TR)

Operating Temperature :

-40°C~85°C TA

Bit Size :

32

Speed :

180MHz

Supply Voltage :

3.3V

Data Converter :

A/D 8x10b; D/A 1x10b

Oscillator Type :

Internal

Pin Count :

100

External Data Bus Width :

32

Voltage - Supply (Vcc/Vdd) :

2.2V~3.6V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of I/O :

49

DMA Channels :

yes

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Supply Voltage-Min (Vsup) :

2.2V

Has ADC :

yes

Clock Frequency :

25MHz

Peripherals :

DMA, I2S, PWM, WDT

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Length :

9mm

RoHS Status :

ROHS3 Compliant

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Address Bus Width :

24