LPC1110FD20,529

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Published :

2010

Data Converter :

A/D 5x10b

Packaging :

Tube

Factory Lead Time :

16 Weeks

Peak Reflow Temperature (Cel) :

260

Terminal Form :

Gull wing

Core Size :

32-Bit

Package / Case :

20-SOIC (0.295, 7.50mm Width)

Peripherals :

Brown-out Detect/Reset, POR, WDT

Connectivity :

I2C, SPI, UART/USART

Series :

LPC1100L

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Operating Temperature :

-40°C~85°C TA

Has ADC :

yes

Mounting Type :

Surface Mount

Base Part Number :

LPC1110

Qualification Status :

Not Qualified

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Number of I/O :

16

Number of Terminations :

20

ROM (words) :

4096

Width :

7.5mm

Program Memory Type :

Flash

Program Memory Size :

4KB 4K x 8

DMA Channels :

No

Height Seated (Max) :

2.65mm

Core Processor :

ARM® Cortex®-M0

RoHS Status :

ROHS3 Compliant

JESD-30 Code :

R-PDSO-G20

Power Supplies :

3.3V

Bit Size :

32

Supply Voltage :

3.3V

Length :

7.5mm

Pin Count :

20

Speed :

50MHz

DAC Channels :

No

Clock Frequency :

25MHz

Supply Voltage-Max (Vsup) :

3.6V

Terminal Pitch :

1.27mm

Moisture Sensitivity Level (MSL) :

2 (1 Year)

Surface Mount :

yes

Source Url Status Check Date :

2013-06-14 00:00:00

Terminal Position :

Dual

Oscillator Type :

Internal

Supply Voltage-Min (Vsup) :

1.8V

RAM Size :

1K x 8

CPU Family :

CORTEX-M0

Voltage - Supply (Vcc/Vdd) :

1.8V~3.6V

PWM Channels :

No