LFXP3C-3QN208C

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Mfr.Part #
LFXP3C-3QN208C
Manufacturer
Lattice Semiconductor
Package / Case
208-BFQFP
Datasheet
Download
Description
IC FPGA 136 I/O 208QFP
Stock
3,507
In Stock :
3,507

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
Number of Logic Elements/Cells :
3000
Pbfree Code :
yes
Radiation Hardening :
No
Number of Terminations :
208
Organization :
384 CLBS
RAM Size :
6.8kB
Mount :
Surface Mount
Combinatorial Delay of a CLB-Max :
0.63 ns
Mounting Type :
Surface Mount
HTS Code :
8542.39.00.01
Terminal Form :
Gull wing
Supply Voltage :
1.8V
Total RAM Bits :
55296
JESD-609 Code :
e3
RoHS Status :
RoHS Compliant
Memory Size :
8.3kB
Number of Logic Cells :
384
Series :
XP
Terminal Finish :
Matte Tin (Sn)
Number of I/O :
136
Lead Free :
Lead Free
Length :
28mm
Power Supplies :
1.8/2.5/3.3V
Number of Outputs :
136
Width :
28mm
Peak Reflow Temperature (Cel) :
245
Number of CLBs :
384
Base Part Number :
LFXP3
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Pitch :
0.5mm
Voltage - Supply :
1.71V~3.465V
Operating Temperature :
0°C~85°C TJ
Terminal Position :
QUAD
Package / Case :
208-BFQFP
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
ECCN Code :
EAR99
Operating Supply Voltage :
1.8V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pin Count :
208
Frequency :
320MHz
Published :
2000
Height Seated (Max) :
4.1mm
Number of Pins :
208
Datasheets
LFXP3C-3QN208C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP3C-3QN208C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:208, Mounting Type:Surface Mount, Base Part Number:LFXP3, Operating Temperature:0°C~85°C TJ, Package / Case:208-BFQFP, Number of Pins:208, LFXP3C-3QN208C pinout, LFXP3C-3QN208C datasheet PDF, LFXP3C-3QN208C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP3C-3QN208C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP3C-3QN208C


FPGAs Lattice Semiconductor LFXP3C-3QN208C Overview

Introducing the LFXP3C-3QN208C from Lattice Semiconductor, a cutting-edge FPGA designed for a broad range of applications that require flexibility, efficiency, and advanced performance in signal and data processing. This device is built to support complex digital systems with its ample logic resources and robust I/O capabilities, housed in a compact 208QFP package. The LFXP3C-3QN208C is particularly suitable for designers looking for a configurable solution that combines low power consumption with high functionality. Its adaptability makes it an excellent choice for rapidly evolving technology requirements, ensuring that your systems are future-proof and highly scalable. With the FPGAs Lattice Semiconductor LFXP3C-3QN208C, engineers and developers gain access to high-level performance that supports innovation and technical precision in demanding environments.

LFXP3C-3QN208C Features

The LFXP3C-3QN208C FPGA boasts a wide array of features that enhance its usability and efficiency in various applications. Key features include:

  • 136 user programmable I/O ports allowing for versatile custom configurations and connections to other components and peripherals.
  • Advanced on-chip memory facilitates efficient data management and high-speed operations.
  • Low power consumption, which is ideal for portable and battery-operated devices, minimizing energy expenditure while maximizing performance.
  • Robust 208-pin Quad Flat Pack (QFP) package that ensures durability and reliability in physical deployment scenarios.
  • Comprehensive support and development tools from Lattice Semiconductor, which help in easing the design process and shortening time-to-market.

LFXP3C-3QN208C Applications

  • Consumer Electronics: Employed in devices such as smartphones, tablets, and wearables where compact size and power efficiency are crucial. The FPGA enables customization of hardware acceleration tasks to enhance device performance.
  • Automotive Systems: Utilized in advanced driver-assistance systems (ADAS) for processing and managing sensor data, improving safety and functionality in automotive applications.
  • Industrial Automation: Acts as a control unit in complex industrial machines, providing the necessary flexibility and speed for real-time processing and control tasks.
  • Telecommunications: Supports infrastructure for both wired and wireless telecommunications networks, facilitating rapid data transmission and signal processing capabilities essential for modern communications systems.
  • Medical Devices: Integrated into medical imaging systems, enhancing the processing capabilities required for detailed and accurate image generation and analysis.
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