LFXP10C-4FN256I

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Mfr.Part #
LFXP10C-4FN256I
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 188 I/O 256FBGA
Stock
23,439
In Stock :
23,439

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
40
Peak Reflow Temperature (Cel) :
250
Number of CLBs :
1216
Published :
2007
Package / Case :
256-BGA
Frequency :
360MHz
RoHS Status :
RoHS Compliant
Operating Temperature :
-40°C~100°C TJ
Voltage - Supply :
1.71V~3.465V
Number of Pins :
256
Radiation Hardening :
No
Operating Supply Voltage :
1.8V
Length :
17mm
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Pin Count :
256
Memory Size :
31.9kB
Terminal Form :
Ball
Organization :
1216 CLBS
Terminal Position :
BOTTOM
Lead Free :
Lead Free
Mount :
Surface Mount
Number of I/O :
188
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
2.1mm
Number of Logic Cells :
1216
Mounting Type :
Surface Mount
Width :
17mm
Total RAM Bits :
221184
Base Part Number :
LFXP10
Pbfree Code :
yes
Number of Logic Elements/Cells :
10000
Supply Voltage :
1.8V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max :
0.53 ns
Power Supplies :
1.8/2.5/3.3V
JESD-609 Code :
e1
Series :
XP
Packaging :
Tray
Number of Gates :
4
RAM Size :
27kB
Terminal Pitch :
1mm
Number of Terminations :
256
Number of Outputs :
188
ECCN Code :
EAR99
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP10C-4FN256I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-BGA, Operating Temperature:-40°C~100°C TJ, Number of Pins:256, Mounting Type:Surface Mount, Base Part Number:LFXP10, Number of Terminations:256, LFXP10C-4FN256I pinout, LFXP10C-4FN256I datasheet PDF, LFXP10C-4FN256I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP10C-4FN256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP10C-4FN256I


FPGAs Lattice Semiconductor LFXP10C-4FN256I Overview

The LFXP10C-4FN256I, manufactured by Lattice Semiconductor, represents a cutting-edge solution within the FPGA (Field Programmable Gate Array) market. This product is engineered to meet the complex requirements of high-speed digital processing and integration. With its compact 256FBGA (Fine Pitch Ball Grid Array) packaging, it offers a robust platform for designing flexible and scalable hardware architectures in a variety of application settings. The inclusion of 188 I/O ports facilitates extensive connectivity and versatility, making it an ideal choice for developers looking to innovate and optimize system performance. Its capacity to support intricate logic operations while maintaining low power consumption and high reliability underscores the FPGAs Lattice Semiconductor LFXP10C-4FN256I's appeal to industrial customers seeking to purchase in bulk.

LFXP10C-4FN256I Features

The LFXP10C-4FN256I FPGA stands out due to its highly efficient architecture, which includes essential features such as low power consumption, high-performance logic matrix, and ample I/O options. It also supports a wide range of configuration schemes, ensuring easy integration into various platforms while allowing designers to leverage its capabilities for innovative applications.

LFXP10C-4FN256I Applications

  • Consumer Electronics: Used in devices like smart TVs and gaming consoles, where its ability to process multiple data streams in real-time enhances the user experience.
  • Industrial Automation: Integrates into control systems for machinery, providing the logic required for complex automation tasks, thus increasing operational efficiency and safety.
  • Automotive: Applies to driver assistance systems, where fast and reliable data processing is crucial for real-time decision-making and performance.
  • Telecommunications: Employs in communication equipment to facilitate high-speed data transfer and signal processing capabilities, essential for modern communication infrastructures.
  • Healthcare: Utilized in medical imaging equipment, enabling rapid image processing and thus supporting advanced diagnostic methods.
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