LFXP10C-3FN388C
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- Mfr.Part #
- LFXP10C-3FN388C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 388-BBGA
- Datasheet
- Download
- Description
- IC FPGA 244 I/O 388FBGA
- Stock
- 2,331
- In Stock ：
- 2,331
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of Pins :
- 388
- Total RAM Bits :
- 221184
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- ECCN Code :
- EAR99
- Operating Supply Voltage :
- 1.8V
- Series :
- XP
- Length :
- 23mm
- Radiation Hardening :
- No
- RoHS Status :
- RoHS Compliant
- Height Seated (Max) :
- 2.6mm
- Number of Logic Cells :
- 1216
- Pbfree Code :
- yes
- Memory Size :
- 31.9kB
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Combinatorial Delay of a CLB-Max :
- 0.63 ns
- JESD-609 Code :
- e1
- Width :
- 23mm
- Power Supplies :
- 1.8/2.5/3.3V
- RAM Size :
- 27kB
- Operating Temperature :
- 0°C~85°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 1.71V~3.465V
- Supply Voltage :
- 1.8V
- Number of CLBs :
- 1216
- Mounting Type :
- Surface Mount
- Package / Case :
- 388-BBGA
- Number of I/O :
- 244
- Terminal Form :
- Ball
- Pin Count :
- 388
- Mount :
- Surface Mount
- Number of Terminations :
- 388
- Frequency :
- 320MHz
- Base Part Number :
- LFXP10
- Terminal Position :
- BOTTOM
- Number of Outputs :
- 244
- HTS Code :
- 8542.39.00.01
- Peak Reflow Temperature (Cel) :
- 250
- Organization :
- 1216 CLBS
- Packaging :
- Tray
- Number of Logic Elements/Cells :
- 10000
- Published :
- 2007
- Lead Free :
- Lead Free
- Datasheets
- LFXP10C-3FN388C
1.8V V 2.6mm mm 31.9kB B FPGAs XP Series 320MHz MHz 388-BBGA 1mm mm 388
LFXP10C-3FN388C Overview
In the package 388-BBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 244 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 10000 logic elements/cells. Supply voltage is 1.8V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.71V~3.465V, this device operates with ease. This is a type of FPGA that is part of the XP series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 244 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 388. Fpga electronics is worth mentioning that this device provides 221184 bfpga electronics s of RAM. LFXP10 is the base part number that can be used to identify related parts. The RAM si27kBe of this FPGA module reaches 27kB so as to guarantee the normal operation of the program during operation. The device has 388 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. This is a battery operated device that operates on 1.8/2.5/3.3V. I am going to present you with a device that is equipped with 388 pins. There is a memory of 31.9kB embedded inside this FPGA module that can be used to store programs and data. The architecture of the system is based on 1216 CLBs. The system operates at a frequency of 320MHz in order to achieve maximum efficiency. It incorporates 1216 logic cells used for the building block.
LFXP10C-3FN388C Features
244 I/Os
Up to 221184 RAM bits
388 LABs/CLBs
Operating from a frequency of 320MHz
LFXP10C-3FN388C Applications
There are a lot of Lattice Semiconductor Corporation
LFXP10C-3FN388C FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
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