LFXP3C-3Q208I

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Mfr.Part #
LFXP3C-3Q208I
Manufacturer
Lattice Semiconductor
Package / Case
208-BFQFP
Datasheet
Download
Description
IC FPGA 136 I/O 208QFP
Stock
44,920
In Stock :
44,920

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
1.71V~3.465V
Height Seated (Max) :
4.1mm
Number of I/O :
136
Number of Terminations :
208
Number of Gates :
2
Time@Peak Reflow Temperature-Max (s) :
30
RAM Size :
6.8kB
Packaging :
Tray
Number of Outputs :
136
Qualification Status :
Not Qualified
Reach Compliance Code :
Unknown
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Max Frequency :
320MHz
Peak Reflow Temperature (Cel) :
225
Mounting Type :
Surface Mount
Operating Supply Voltage :
1.8V
Number of Logic Blocks (LABs) :
375
Organization :
384 CLBS
Mount :
Surface Mount
Terminal Position :
QUAD
Package / Case :
208-BFQFP
Memory Size :
8.3kB
Base Part Number :
LFXP3
Terminal Finish :
Tin/Lead (Sn85Pb15)
Series :
XP
Published :
2000
Pin Count :
208
Terminal Form :
Gull wing
Lead Free :
Lead Free
JESD-609 Code :
e0
Supply Voltage :
1.8V
Number of Logic Elements/Cells :
3000
ECCN Code :
EAR99
Number of CLBs :
384
Combinatorial Delay of a CLB-Max :
0.63 ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Total RAM Bits :
55296
Number of Pins :
208
Terminal Pitch :
0.5mm
Operating Temperature :
-40°C~100°C TJ
Number of Logic Cells :
384
Pbfree Code :
No
RoHS Status :
Non-RoHS Compliant
Datasheets
LFXP3C-3Q208I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP3C-3Q208I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:208, Mounting Type:Surface Mount, Package / Case:208-BFQFP, Base Part Number:LFXP3, Number of Pins:208, Operating Temperature:-40°C~100°C TJ, LFXP3C-3Q208I pinout, LFXP3C-3Q208I datasheet PDF, LFXP3C-3Q208I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP3C-3Q208I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP3C-3Q208I


FPGAs Lattice Semiconductor LFXP3C-3Q208I Overview

Introducing the LFXP3C-3Q208I from Lattice Semiconductor, a high-performance FPGA (Field Programmable Gate Array) designed to meet the demanding needs of modern electronics. This device is part of Lattice's LatticeXP family, known for its versatile programmability and low power consumption. The LFXP3C-3Q208I is engineered to offer robust I/O capabilities within a compact 208QFP package, making it ideal for applications requiring dense configurations and minimal footprint. This FPGA is an excellent choice for designers looking to leverage a combination of speed, efficiency, and flexibility in their hardware solutions.

LFXP3C-3Q208I Features

The LFXP3C-3Q208I boasts an array of features suited for a wide range of applications. It features 136 user I/Os, allowing extensive interfacing with other digital systems and components. The non-volatile configuration memory enhances device security and simplifies the system design by eliminating the need for external configuration sources. Its performance is optimized for low-power operations, which is crucial for portable and energy-sensitive applications. Furthermore, its quick startup capabilities are essential for applications that require rapid activation and deployment.

LFXP3C-3Q208I Applications

  • Consumer Electronics: Used in devices such as smartphones, tablets, and wearables to provide flexible logic for user interface and peripheral management.
  • Industrial Automation: Integrates into control systems for sensors and actuators, enhancing processing capabilities and system reliability in harsh environments.
  • Automotive: Contributes to advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors for real-time decision making.
  • Telecommunications: Supports infrastructure by managing data flow and signal processing in network equipment.
  • Medical Devices: Utilized in medical imaging systems, enabling complex digital processing tasks that are required for high-resolution diagnostics.
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