LFXP2-40E-6FN672I

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Mfr.Part #
LFXP2-40E-6FN672I
Manufacturer
Lattice Semiconductor
Package / Case
672-BBGA
Datasheet
Download
Description
IC FPGA 540 I/O 672FPBGA
Stock
6,251
In Stock :
6,251

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Mount :
Surface Mount
Number of Outputs :
540
Width :
27mm
Terminal Position :
BOTTOM
Published :
2013
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
ECCN Code :
EAR99
Packaging :
Tray
Operating Temperature :
-40°C~100°C TJ
JESD-609 Code :
e1
Power Supplies :
1.21.2/3.33.3V
Supply Voltage :
1.2V
RoHS Status :
ROHS3 Compliant
Reach Compliance Code :
not_compliant
Operating Supply Voltage :
1.2V
Combinatorial Delay of a CLB-Max :
0.399 ns
HTS Code :
8542.39.00.01
Base Part Number :
LFXP2-40
Memory Size :
121kB
Peak Reflow Temperature (Cel) :
250
Total RAM Bits :
906240
Number of I/O :
540
Height Seated (Max) :
2.6mm
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Number of Logic Elements/Cells :
40000
Number of Terminations :
672
Package / Case :
672-BBGA
Series :
XP2
Terminal Form :
Ball
Voltage - Supply :
1.14V~1.26V
Clock Frequency :
435MHz
Number of LABs/CLBs :
5000
Number of Pins :
672
Length :
27mm
Qualification Status :
Not Qualified
Pin Count :
672
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RAM Size :
110.6kB
Lead Free :
Lead Free
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Factory Lead Time :
8 Weeks
Datasheets
LFXP2-40E-6FN672I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP2-40E-6FN672I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:LFXP2-40, Number of Terminations:672, Package / Case:672-BBGA, Number of Pins:672, Mounting Type:Surface Mount, LFXP2-40E-6FN672I pinout, LFXP2-40E-6FN672I datasheet PDF, LFXP2-40E-6FN672I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP2-40E-6FN672I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP2-40E-6FN672I


FPGAs Lattice Semiconductor LFXP2-40E-6FN672I Overview

The FPGAs Lattice Semiconductor LFXP2-40E-6FN672I is a highly capable field programmable gate array that offers versatility and performance suitable for a broad range of industrial applications. This component is designed to meet the rigorous demands of modern electronic environments, featuring a robust 672-ball fine pitch BGA package that enhances system reliability. With its substantial number of I/O options, totaling 540, this FPGA allows for extensive customization and scalability, providing engineers with the flexibility to design and optimize their systems for maximum efficiency and performance.

LFXP2-40E-6FN672I Features

The LFXP2-40E-6FN672I FPGA from Lattice Semiconductor is equipped with numerous features that make it a powerful choice for complex electronics systems. Key attributes include a high I/O pin count, a compact 672FPBGA package, and a design that emphasizes energy efficiency. Its programmability ensures that it can be integrated into varied hardware configurations, thus facilitating rapid development and deployment of technology in fields requiring high-speed data processing and customizable logic solutions.

LFXP2-40E-6FN672I Applications

  • Communications Infrastructure: Utilized in routers, switches, and other network hardware to manage data flow efficiently and support high-speed communications.
  • Consumer Electronics: Integrated into devices such as gaming consoles and high-definition televisions to enhance processing capabilities and support advanced user interfaces and graphics.
  • Automotive Systems: Deployed in automotive electronics for managing complex systems such as infotainment, advanced driver-assistance systems (ADAS), and vehicle-to-everything (V2X) communications.
  • Industrial Automation: Ideal for use in control systems, robotic arms, and automated test equipment, where flexibility and reprogrammability are essential for adaptive manufacturing processes.
  • Medical Devices: Critical in the design of medical imaging systems like MRI and ultrasound machines, improving the processing speed and image quality necessary for precise diagnostics.
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