FDB8444
- Mfr.Part #
- FDB8444
- Manufacturer
- onsemi
- Package / Case
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Datasheet
- Download
- Description
- MOSFET N-CH 40V 70A TO263AB
- Stock
- 275
- In Stock :
- 275
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- Manufacturer :
- onsemi
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Fall Time (Typ) :
- 15 ns
- Lead Free :
- Lead Free
- Radiation Hardening :
- No
- FET Type :
- N-Channel
- Mounting Type :
- Surface Mount
- Input Capacitance (Ciss) (Max) @ Vds :
- 8035pF @ 25V
- Resistance :
- 5.5mOhm
- JESD-609 Code :
- e3
- Factory Lead Time :
- 8 Weeks
- Number of Elements :
- 1
- Operating Mode :
- ENHANCEMENT MODE
- Package / Case :
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Terminal Finish :
- Tin (Sn)
- Drain to Source Breakdown Voltage :
- 40V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- ECCN Code :
- EAR99
- Vgs (Max) :
- ±20V
- Turn On Delay Time :
- 12 ns
- Avalanche Energy Rating (Eas) :
- 307 mJ
- RoHS Status :
- ROHS3 Compliant
- Terminal Form :
- Gull wing
- JESD-30 Code :
- R-PSSO-G2
- Pbfree Code :
- yes
- Element Configuration :
- Single
- Gate Charge (Qg) (Max) @ Vgs :
- 128nC @ 10V
- Gate to Source Voltage (Vgs) :
- 20V
- Packaging :
- Tape and Reel (TR)
- Case Connection :
- DRAIN
- Rise Time :
- 78ns
- Weight :
- 1.31247g
- Mount :
- Surface Mount
- Operating Temperature :
- -55°C~175°C TJ
- Turn-Off Delay Time :
- 48 ns
- Series :
- PowerTrench®
- Transistor Element Material :
- SILICON
- Number of Terminations :
- 2
- Power Dissipation :
- 167W
- Power Dissipation-Max :
- 167W Tc
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Transistor Application :
- SWITCHING
- Lifecycle Status :
- ACTIVE (Last Updated: 1 day ago)
- Current - Continuous Drain (Id) @ 25°C :
- 70A Tc
- Rds On (Max) @ Id, Vgs :
- 5.5m Ω @ 70A, 10V
- Continuous Drain Current (ID) :
- 70A
- Datasheets
- FDB8444

N-Channel Tape & Reel (TR) 5.5m Ω @ 70A, 10V ±20V 8035pF @ 25V 128nC @ 10V TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
FDB8444 Overview
The MOSFET's breakdown is called "avalanche break down", and the avalanche energy applied to transistor is rated as 307 mJ (Eas).An op amp's input capacitance is defined as the capacitance between both of its input terminals with either input grounded, and 8035pF @ 25V is its maximum input capacitance.The drain current is the maximum continuous current the device can conduct, and this device has 70A continuous drain current (ID).A drainage-to-source breakdown voltage corresponds to the voltage at which a specified value of ID flows, where VGS is 40V, and this device has a drainage-to-source breakdown voltage of 40VV.Input capacitance must be charged before drain current conduction can begin, so the turn-off delay time is 48 ns.Before drain current conduction begins, the device's input capacitance must be charged, so the delay time is 12 ns.An FET transistor's gate-source voltage, VGS, indicates how much voltage is applied across the transistor's gate-source terminal and it can range from 20V to 1.Using drive voltage (10V), this device contributes to a reduction in overall power consumption.
FDB8444 Features
the avalanche energy rating (Eas) is 307 mJ
a continuous drain current (ID) of 70A
a drain-to-source breakdown voltage of 40V voltage
the turn-off delay time is 48 ns
FDB8444 Applications
There are a lot of ON Semiconductor
FDB8444 applications of single MOSFETs transistors.
- AC-DC Power Supply
- Synchronous Rectification for ATX 1 Server I Telecom PSU
- Motor drives and Uninterruptible Power Supplies
- Micro Solar Inverter
- DC/DC converters
- Power Tools
- Motor Drives and Uninterruptible Power Supples
- Synchronous Rectification
- Battery Protection Circuit
- Telecom 1 Sever Power Supplies
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