DDB6U134N16RRB11BPSA1
- Mfr.Part #
- DDB6U134N16RRB11BPSA1
- Manufacturer
- Infineon Technologies
- Package / Case
- Datasheet
- Download
- Description
- IGBT MODULE
- Stock
- 9
- In Stock :
- 9
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - IGBTs - Modules
- Case Connection :
- Isolated
- Published :
- 2006
- Factory Lead Time :
- 16 Weeks
- Collector Current-Max (IC) :
- 70A
- Surface Mount :
- No
- Terminal Position :
- UPPER
- Polarity/Channel Type :
- N-Channel
- ECCN Code :
- EAR99
- Configuration :
- SINGLE WITH BUILT-IN DIODE, THREE PHASE DIODE BRIDGE AND THERMISTOR
- Terminal Form :
- UNSPECIFIED
- JESD-30 Code :
- R-XUFM-X19
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Number of Terminations :
- 19
- Transistor Element Material :
- SILICON
- Operating Temperature (Max) :
- 150°C
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Collector-Emitter Voltage-Max :
- 1200V
- Transistor Application :
- POWER CONTROL
- Number of Elements :
- 1
- Datasheets
- DDB6U134N16RRB11BPSA1

DDB6U134N16RRB11BPSA1 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available at
DDB6U134N16RRB11BPSA1 Description
The DDB6U134N16RRB11BPSA1 is an EconoPACK™2 module with Low Loss IGBT2 and Emitter Controlled diode and PressFIT/NTC. The abbreviated version of insulated-gate bipolar transistor is IGBT, which is a power semiconductor die. A grouping of numerous IGBT power semiconductor dies in one physical package is known as an IGBT power module.
DDB6U134N16RRB11BPSA1 Features
-
Mechanical Features
-
Compact design
-
PressFIT Contact Technology
-
RoHS compliant
-
Standard Housing
-
Al2O3 Substrate with Low Thermal Resistance
-
High Power Density
-
Isolated Base Plate
-
Compact design
DDB6U134N16RRB11BPSA1 Applications
-
Motor Drives
-
Servo Drives
-
Auxiliary Inverters
-
Air Conditioning
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