D6417709SF133BV

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Mfr.Part #
D6417709SF133BV
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
208-LQFP
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 208LQFP
Stock
6,014
In Stock :
6,014

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
Frequency :
133MHz
RAM Size :
16K x 8
Series :
SuperH® SH7700
Packaging :
Tray
Peripherals :
DMA, POR, WDT
Number of Pins :
208
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
96
Package / Case :
208-LQFP
Core Size :
32-Bit
Data Converter :
A/D 8x10b; D/A 2x8b
Oscillator Type :
Internal
Program Memory Type :
ROMless
Base Part Number :
D6417709S
Interface :
EBI/EMI, IrDA, SCI
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
Published :
2003
Data Bus Width :
32b
Connectivity :
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Lead Free :
Lead Free
Watchdog Timer :
yes
Factory Lead Time :
20 Weeks
Voltage - Supply (Vcc/Vdd) :
1.65V~2.05V
Operating Temperature :
-20°C~75°C TA
Mount :
Surface Mount
Core Processor :
SH-3
Pin Count :
208
Number of Timers/Counters :
4
Access Time :
133 μs
Datasheets
D6417709SF133BV
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) D6417709SF133BV from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:208, Package / Case:208-LQFP, Base Part Number:D6417709S, Mounting Type:Surface Mount, Operating Temperature:-20°C~75°C TA, D6417709SF133BV pinout, D6417709SF133BV datasheet PDF, D6417709SF133BV amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) D6417709SF133BV ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) D6417709SF133BV


Microcontrollers Intersil (Renesas Electronics Corporation) D6417709SF133BV Overview

The Microcontrollers Intersil (Renesas Electronics Corporation) D6417709SF133BV is an advanced 32-bit MCU tailored for applications requiring high-performance computing and a variety of connectivity options without the need for internal ROM. This microcontroller is specifically designed to meet the rigorous demands of modern embedded systems. It provides a robust platform for development with its large set of features, including extensive IO capabilities and advanced security measures, making it an ideal choice for engineers and developers looking to push the boundaries of technology in their applications.

D6417709SF133BV Features

The D6417709SF133BV MCU stands out with its ROMless architecture, allowing for greater flexibility in system design. This feature is complemented by a 208-pin LQFP (Low-profile Quad Flat Package) that ensures compactness and a high degree of integration. The processor's 32-bit architecture facilitates efficient handling of complex algorithms and tasks, making it suitable for intensive applications. Additional features include comprehensive interrupt management, robust timer systems, and versatile peripheral support, all of which contribute to a highly flexible and powerful microcontroller solution.

D6417709SF133BV Applications

  • Industrial Automation: This MCU can be integrated into control systems for machinery, improving efficiency and reliability in processes such as manufacturing and assembly.
  • Automotive Systems: Suitable for use in automotive applications, the D6417709SF133BV can manage engine control units and advanced driver-assistance systems (ADAS), enhancing vehicle performance and safety.
  • Smart Home Devices: Its capability to handle multiple inputs and outputs makes it perfect for smart home systems, including home automation hubs and security systems.
  • Healthcare Equipment: The MCU’s high precision and connectivity features make it ideal for healthcare applications like medical monitoring devices and diagnostic systems.
This HTML content provides a structured, professional overview of the D6417709SF133BV MCU, its features, and potential applications, targeting B2B customers and highlighting the versatility and advanced capabilities of the product.
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