CYD18S72V18-200BBXC
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- Mfr.Part #
- CYD18S72V18-200BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 256FBGA
- Stock
- 49,377
- In Stock ：
- 49,377
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Memory Format :
- SRAM
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Max Operating Temperature :
- 70°C
- RoHS Status :
- ROHS3 Compliant
- Access Time :
- 3.3ns
- Density :
- 18 Mb
- Lead Free :
- Lead Free
- Address Bus Width :
- 36b
- Published :
- 2005
- Number of Ports :
- 2
- Memory Size :
- 18Mb 256K x 72
- Package / Case :
- 256-LBGA
- Operating Supply Voltage :
- 1.8V
- Packaging :
- Tray
- Supplier Device Package :
- 256-FBGA (17x17)
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Memory Interface :
- Parallel
- Frequency :
- 200MHz
- Memory Type :
- Volatile
- Interface :
- Parallel
- Min Operating Temperature :
- 0°C
- Clock Frequency :
- 200MHz
- Operating Temperature :
- 0°C~70°C TA
- Base Part Number :
- CYD18S72
- Number of Pins :
- 256
- Datasheets
- CYD18S72V18-200BBXC
Memory Infineon Technologies CYD18S72V18-200BBXC Overview
The Memory Infineon Technologies CYD18S72V18-200BBXC is an advanced 18Mbit SRAM module designed by Infineon Technologies, catering specifically to high-performance data storage needs. This memory chip, housed in a 256FBGA package, offers robust parallel interface capabilities, making it ideal for applications requiring fast access and high bandwidth. With its large storage capacity and compact form factor, the CYD18S72V18-200BBXC is engineered to support the demanding memory requirements of modern electronic systems, enhancing overall system reliability and performance.
CYD18S72V18-200BBXC Features
This SRAM chip features a 18Mbit capacity with a parallel interface, ensuring quick data access and high-speed operations. The 256FBGA packaging is optimized for efficient space usage and enhanced thermal management, making it suitable for densely packed electronic assemblies. Additionally, its robust design ensures reliability and durability under extensive industrial usage scenarios.
CYD18S72V18-200BBXC Applications
- Networking Equipment: Utilized in routers and switches for buffer memory, improving packet transfer speeds and reducing latency.
- High-Performance Computing: Acts as cache memory in servers and workstations to speed up processing times and handle large datasets efficiently.
- Automotive Electronics: Employed in advanced driver-assistance systems (ADAS) for real-time processing and data storage, enhancing vehicle safety and performance.
- Telecommunications: Used in telecom infrastructure to manage data flow and signal processing, ensuring high reliability and service availability.
- Industrial Automation: Integral to control systems in manufacturing processes, providing fast data access to manage operational parameters and system responses.
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