BU7244FV-E2

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Mfr.Part #
BU7244FV-E2
Manufacturer
ROHM Semiconductor
Package / Case
14-LSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC CMOS 4 CIRCUIT 14SSOPB
Stock
1,313
In Stock :
1,313

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Manufacturer :
ROHM Semiconductor
Product Category :
Instrumentation, OP Amps, Buffer Amps
Input Offset Voltage (Vos) :
1mV
Operating Temperature :
-40°C~85°C
Packaging :
Tape and Reel (TR)
Bandwidth :
900 kHz
Number of Circuits :
4
Common Mode Rejection Ratio :
60 dB
Mounting Type :
Surface Mount
Published :
2014
Mount :
Surface Mount
Max Power Dissipation :
700mW
Package / Case :
14-LSSOP (0.173, 4.40mm Width)
Slew Rate :
0.4V/µs
ECCN Code :
EAR99
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Terminal Position :
Dual
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Amplifier Type :
CMOS
Factory Lead Time :
9 Weeks
Unity Gain BW-Nom :
900 kHz
Current - Input Bias :
1pA
Terminal Form :
Gull wing
Number of Terminations :
14
Number of Pins :
14
Voltage - Input Offset :
1mV
RoHS Status :
ROHS3 Compliant
Length :
5mm
Terminal Pitch :
0.65mm
Voltage - Supply, Single/Dual (±) :
1.8V~5.5V
Supply Voltage Limit-Max :
7V
Height Seated (Max) :
1.35mm
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of Functions :
4
Operating Supply Current :
360μA
Output Current per Channel :
12mA
Supply Voltage :
3V
Datasheets
BU7244FV-E2
Introducing Instrumentation, OP Amps, Buffer Amps ROHM Semiconductor BU7244FV-E2 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C, Bandwidth:900 kHz, Mounting Type:Surface Mount, Package / Case:14-LSSOP (0.173, 4.40mm Width), Number of Terminations:14, Number of Pins:14, BU7244FV-E2 pinout, BU7244FV-E2 datasheet PDF, BU7244FV-E2 amp .Beyond Instrumentation, OP Amps, Buffer Amps ROHM Semiconductor BU7244FV-E2 ,we also offer OP07CDR, TS321CX5 RFG, NE5532ADR, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BU7244FV-E2


Instrumentation, OP Amps, Buffer Amps ROHM Semiconductor BU7244FV-E2 Overview

ROHM Semiconductor's BU7244FV-E2 is an advanced integrated circuit designed for precise signal processing in instrumentation, operational amplifiers, and buffer amplifier applications. With its cutting-edge CMOS technology, this IC offers exceptional performance and reliability, making it ideal for demanding industrial and commercial environments.

Featuring a compact 14SSOPB package, the BU7244FV-E2 enables seamless integration into various electronic systems, providing engineers with flexibility and convenience during design and assembly processes. Whether used in medical devices, automotive systems, or industrial machinery, this versatile IC delivers consistent results and enhances overall system efficiency.

Engineered to meet the highest quality standards, the BU7244FV-E2 from ROHM Semiconductor empowers businesses to achieve precision, reliability, and innovation in their products, driving success in today's competitive markets.

BU7244FV-E2 Features

  • Advanced CMOS technology for precise signal processing
  • Compact 14SSOPB package for easy integration
  • High reliability and performance in demanding environments
  • Wide range of operating voltage and temperature
  • Low power consumption for energy-efficient designs
  • Robust protection features for enhanced durability

BU7244FV-E2 Applications

  • Medical Instruments: The BU7244FV-E2 is utilized in medical devices such as patient monitoring systems and diagnostic equipment to ensure accurate signal processing and reliable performance, enhancing patient care and safety.
  • Automotive Electronics: In automotive systems like engine control units (ECUs) and safety systems, this IC plays a critical role in signal conditioning and processing, enabling efficient operation and optimal vehicle performance.
  • Industrial Automation: Integrated into industrial machinery and automation systems, the BU7244FV-E2 facilitates precise control and monitoring of processes, improving productivity, and reducing downtime.
  • Communication Systems: From telecommunications infrastructure to data transmission equipment, this IC enhances signal integrity and efficiency, enabling seamless communication in diverse applications.
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