BU1852GUW-E2

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Mfr.Part #
BU1852GUW-E2
Manufacturer
ROHM Semiconductor
Package / Case
35-VFBGA
Datasheet
Download
Description
IC INTERFACE SPECIALIZED 35VBGA
Stock
22,938
In Stock :
22,938

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Manufacturer :
ROHM Semiconductor
Product Category :
Specialized
HTS Code :
8542.39.00.01
Number of Functions :
1
Supply Voltage-Min (Vsup) :
1.65V
Height Seated (Max) :
0.9mm
Operating Temperature (Max) :
85°C
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
4mm
Packaging :
Tape and Reel (TR)
Terminal Position :
BOTTOM
Base Part Number :
BU1852
Terminal Pitch :
0.5mm
Number of Terminations :
35
Mounting Type :
Surface Mount
Mount :
Surface Mount
Supply Voltage-Max (Vsup) :
1.95V
Analog IC - Other Type :
ANALOG CIRCUIT
Terminal Form :
Ball
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Package / Case :
35-VFBGA
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Operating Temperature (Min) :
-30°C
Number of Pins :
35
Published :
2012
Supply Voltage :
1.8V
Factory Lead Time :
10 Weeks
Length :
4mm
Temperature Grade :
Other
Voltage - Supply :
1.65V~3.6V
Qualification Status :
Not Qualified
RoHS Status :
ROHS3 Compliant
Pbfree Code :
yes
Pin Count :
35
Datasheets
BU1852GUW-E2
Introducing Specialized ROHM Semiconductor BU1852GUW-E2 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:BU1852, Number of Terminations:35, Mounting Type:Surface Mount, Package / Case:35-VFBGA, Number of Pins:35, BU1852GUW-E2 pinout, BU1852GUW-E2 datasheet PDF, BU1852GUW-E2 amp .Beyond Specialized ROHM Semiconductor BU1852GUW-E2 ,we also offer DS90CR285MTDX/NOPB, USB2640I-HZH-02, LTC4316CMS#PBF, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BU1852GUW-E2


Specialized ROHM Semiconductor BU1852GUW-E2 Overview

Introducing the Specialized ROHM Semiconductor BU1852GUW-E2, a cutting-edge IC INTERFACE designed for specialized applications. This product from ROHM Semiconductor integrates multiple functionalities into a compact 35VBGA package, ensuring high reliability and performance. The BU1852GUW-E2 is engineered to meet the demanding requirements of high-speed data communication and processing tasks. With its robust design and advanced technology, this IC offers a versatile solution for manufacturers looking to enhance their systems with superior interface capabilities.

BU1852GUW-E2 Features

The BU1852GUW-E2 IC boasts a range of features designed to provide optimal efficiency and functionality in complex electronic environments. Key features include its compact 35VBGA packaging that allows for streamlined integration into existing systems without compromising on performance. The chip is crafted to handle specialized interface tasks with unparalleled ease, making it an ideal choice for applications requiring high precision and robust data handling capabilities.

BU1852GUW-E2 Applications

  • Telecommunications Equipment: In telecommunication systems, the BU1852GUW-E2 can be utilized to manage data flow and signal processing efficiently, enhancing communication reliability and speed.
  • Consumer Electronics: This IC finds applications in consumer electronics such as smartphones and tablets, where it supports advanced user interfaces and connectivity options.
  • Automotive Systems: The BU1852GUW-E2 is also suitable for automotive applications, where it helps in the management of vehicle internal communications and infotainment systems, ensuring seamless operation and integration.
  • Industrial Automation: In industrial settings, the BU1852GUW-E2 facilitates robust data handling and machine-to-machine communications, crucial for automated processes and systems control.
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