BU1852GUW-E2
- Mfr.Part #
- BU1852GUW-E2
- Manufacturer
- ROHM Semiconductor
- Package / Case
- 35-VFBGA
- Datasheet
- Download
- Description
- IC INTERFACE SPECIALIZED 35VBGA
- Stock
- 22,938
- In Stock :
- 22,938
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- Manufacturer :
- ROHM Semiconductor
- Product Category :
- Specialized
- HTS Code :
- 8542.39.00.01
- Number of Functions :
- 1
- Supply Voltage-Min (Vsup) :
- 1.65V
- Height Seated (Max) :
- 0.9mm
- Operating Temperature (Max) :
- 85°C
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 4mm
- Packaging :
- Tape and Reel (TR)
- Terminal Position :
- BOTTOM
- Base Part Number :
- BU1852
- Terminal Pitch :
- 0.5mm
- Number of Terminations :
- 35
- Mounting Type :
- Surface Mount
- Mount :
- Surface Mount
- Supply Voltage-Max (Vsup) :
- 1.95V
- Analog IC - Other Type :
- ANALOG CIRCUIT
- Terminal Form :
- Ball
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Package / Case :
- 35-VFBGA
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Temperature (Min) :
- -30°C
- Number of Pins :
- 35
- Published :
- 2012
- Supply Voltage :
- 1.8V
- Factory Lead Time :
- 10 Weeks
- Length :
- 4mm
- Temperature Grade :
- Other
- Voltage - Supply :
- 1.65V~3.6V
- Qualification Status :
- Not Qualified
- RoHS Status :
- ROHS3 Compliant
- Pbfree Code :
- yes
- Pin Count :
- 35
- Datasheets
- BU1852GUW-E2

Specialized ROHM Semiconductor BU1852GUW-E2 Overview
Introducing the Specialized ROHM Semiconductor BU1852GUW-E2, a cutting-edge IC INTERFACE designed for specialized applications. This product from ROHM Semiconductor integrates multiple functionalities into a compact 35VBGA package, ensuring high reliability and performance. The BU1852GUW-E2 is engineered to meet the demanding requirements of high-speed data communication and processing tasks. With its robust design and advanced technology, this IC offers a versatile solution for manufacturers looking to enhance their systems with superior interface capabilities.
BU1852GUW-E2 Features
The BU1852GUW-E2 IC boasts a range of features designed to provide optimal efficiency and functionality in complex electronic environments. Key features include its compact 35VBGA packaging that allows for streamlined integration into existing systems without compromising on performance. The chip is crafted to handle specialized interface tasks with unparalleled ease, making it an ideal choice for applications requiring high precision and robust data handling capabilities.
BU1852GUW-E2 Applications
- Telecommunications Equipment: In telecommunication systems, the BU1852GUW-E2 can be utilized to manage data flow and signal processing efficiently, enhancing communication reliability and speed.
- Consumer Electronics: This IC finds applications in consumer electronics such as smartphones and tablets, where it supports advanced user interfaces and connectivity options.
- Automotive Systems: The BU1852GUW-E2 is also suitable for automotive applications, where it helps in the management of vehicle internal communications and infotainment systems, ensuring seamless operation and integration.
- Industrial Automation: In industrial settings, the BU1852GUW-E2 facilitates robust data handling and machine-to-machine communications, crucial for automated processes and systems control.
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