BR93G66FVJ-3AGTE2

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Mfr.Part #
BR93G66FVJ-3AGTE2
Manufacturer
ROHM Semiconductor
Package / Case
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Datasheet
Download
Description
IC EEPROM 4KBIT SPI 3MHZ 8TSSOP
Stock
80
In Stock :
80

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Manufacturer :
ROHM Semiconductor
Product Category :
Memory
Operating Mode :
SYNCHRONOUS
Additional Feature :
ALSO AVAILABLE 1.7V-2.5V OPERATES WITH 1MHZ, 2.5V-4.5V OPERATES WITH 2MHZ
Packaging :
Cut Tape (CT)
JESD-30 Code :
S-PDSO-G8
Voltage - Supply :
1.7V~5.5V
Terminal Pitch :
0.65mm
Factory Lead Time :
11 Weeks
Write Cycle Time - Word, Page :
5ms
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Memory Type :
Non-Volatile
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Memory Format :
EEPROM
Surface Mount :
yes
Terminal Position :
Dual
Supply Voltage :
5V
Memory Density :
4096 bit
Memory Width :
16
Organization :
256X16
Serial Bus Type :
3-WIRE
Width :
3mm
Operating Temperature :
-40°C~85°C TA
Number of Terminations :
8
RoHS Status :
ROHS3 Compliant
Clock Frequency :
3MHz
Length :
3mm
Height Seated (Max) :
1.1mm
Supply Voltage-Min (Vsup) :
4.5V
Number of Functions :
1
Supply Voltage-Max (Vsup) :
5.5V
Parallel/Serial :
Serial
Write Cycle Time-Max (tWC) :
5ms
Memory Size :
4Kb 256 x 16
Memory Interface :
SPI
Package / Case :
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Datasheets
BR93G66FVJ-3AGTE2
Introducing Memory ROHM Semiconductor BR93G66FVJ-3AGTE2 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Number of Terminations:8, Package / Case:8-TSSOP, 8-MSOP (0.118, 3.00mm Width), BR93G66FVJ-3AGTE2 pinout, BR93G66FVJ-3AGTE2 datasheet PDF, BR93G66FVJ-3AGTE2 amp .Beyond Memory ROHM Semiconductor BR93G66FVJ-3AGTE2 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BR93G66FVJ-3AGTE2


Memory ROHM Semiconductor BR93G66FVJ-3AGTE2 Overview

The Memory ROHM Semiconductor BR93G66FVJ-3AGTE2 is a state-of-the-art IC EEPROM device, expertly crafted to meet the high standards of today's digital storage needs. Designed by ROHM Semiconductor, a leader in the semiconductor industry, this product features a 4Kbit memory size and operates over a SPI interface, ensuring fast and reliable communication speeds up to 3MHz. Packaged in a compact 8TSSOP, it offers excellent durability and ease of integration in various applications. The Memory ROHM Semiconductor BR93G66FVJ-3AGTE2 is an ideal solution for businesses looking to leverage advanced memory technology for efficient data management and robust performance in critical applications.

BR93G66FVJ-3AGTE2 Features

This EEPROM IC offers several features that make it highly advantageous for use in technology-driven environments. Key features include:

  • 4Kbit EEPROM: Ample storage for configuration data and parameters, essential for firmware and device functionality.
  • SPI Interface: High-speed serial interface ensures quick data transfer rates up to 3MHz, enhancing overall device responsiveness.
  • Low Voltage Operation: Efficient operation at low voltages enhances compatibility with contemporary low-power devices and systems.
  • Small Footprint: The 8TSSOP package is ideal for space-constrained applications, allowing for minimalistic designs without compromising performance.
  • Durability: Designed to withstand rigorous conditions, ensuring reliability and a long operational life.

BR93G66FVJ-3AGTE2 Applications

  • Consumer Electronics: Used in devices such as smart TVs and digital cameras, where reliable EEPROM storage helps maintain device settings and user preferences.
  • Industrial Automation: Integrates into control systems for machines and robots, storing essential configuration and calibration data that enhance operational accuracy and reliability.
  • Automotive Systems: Employed in vehicle infotainment systems and ECUs (Electronic Control Units), providing robust data retention capabilities under extreme conditions.
  • Telecommunications: Supports network devices like routers and switches, storing firmware and configuration information crucial for device functionality and network reliability.
  • Medical Devices: Applied in medical monitoring equipment, ensuring the retention of critical calibration data and patient-specific settings, vital for device accuracy and patient safety.
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