BR25A256F-3MGE2

Manufacturer :

ROHM Semiconductor

Product Category :

Memory

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Height Seated (Max) :

1.71mm

Surface Mount :

yes

Length :

5mm

Width :

4.4mm

Supply Voltage-Min (Vsup) :

2.5V

Packaging :

Tape and Reel (TR)

Memory Format :

EEPROM

Memory Type :

Non-Volatile

Memory Interface :

SPI

Voltage - Supply :

2.5V~5.5V

Write Cycle Time - Word, Page :

5ms

Serial Bus Type :

SPI

Terminal Position :

Dual

Memory Density :

262144 bit

RoHS Status :

ROHS3 Compliant

Additional Feature :

SEATED HT-CALCULATED

Number of Functions :

1

Memory Size :

256Kb 32K x 8

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

JESD-30 Code :

R-PDSO-G8

Terminal Pitch :

1.27mm

Clock Frequency :

10MHz

Package / Case :

8-SOIC (0.173, 4.40mm Width)

Factory Lead Time :

9 Weeks

Organization :

32KX8

Series :

Automotive, AEC-Q100

Number of Terminations :

8

Write Cycle Time-Max (tWC) :

5ms

Supply Voltage-Max (Vsup) :

5.5V

Parallel/Serial :

Serial

Mounting Type :

Surface Mount

Operating Mode :

SYNCHRONOUS

Memory Width :

8

Operating Temperature :

-40°C~105°C TA