XCVM1802-2MLIVFVC1760

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Mfr.Part #
XCVM1802-2MLIVFVC1760
Manufacturer
AMD Xilinx
Package / Case
1760-BFBGA, FCBGA
Datasheet
Download
Description
IC VERSAL AICORE FPGA 1760BGA
Stock
15,452
In Stock :
15,452

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
RoHS :
Details
Primary Attributes :
Versal™ Prime FPGA, 1.9M Logic Cells
Series :
Versal™ Prime
Flash Size :
-
Supplier Device Package :
1760-FCBGA (40x40)
Minimum Operating Temperature :
- 40 C
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
RAM Size :
256KB
Package :
Tray
Speed :
600MHz, 1.4GHz
Product Status :
Active
Operating Temperature :
-40°C ~ 100°C (TJ)
Maximum Operating Temperature :
+ 110 C
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case :
1760-BFBGA, FCBGA
Number of I/O :
500
Operating Supply Voltage :
800 mV
Peripherals :
DDR, DMA, PCIe
Architecture :
MPU, FPGA
Introducing System On Chip (SoC) AMD Xilinx XCVM1802-2MLIVFVC1760 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 100°C (TJ), Package / Case:1760-BFBGA, FCBGA, XCVM1802-2MLIVFVC1760 pinout, XCVM1802-2MLIVFVC1760 datasheet PDF, XCVM1802-2MLIVFVC1760 amp .Beyond System On Chip (SoC) AMD Xilinx XCVM1802-2MLIVFVC1760 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVM1802-2MLIVFVC1760


-40°C ~ 100°C (TJ) System On Chip Versal™ Prime Series 500 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 1760-BFBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MPU, FPGA technique.It is part of the Versal™ Prime series of system on a chips.It is recommended that this SoC meaning be operated at -40°C ~ 100°C (TJ) on an average.As one of the most important things to note is that this SoC security combines Versal™ Prime FPGA, 1.9M Logic Cells together.An integral part of this SoC consists of a total of 500 I/Os.As for its flash size, it is -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


256KB RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVM1802-2MLIVFVC1760 System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
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