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XCVM1302-1LLINBVB1024

XCVM1302-1LLINBVB1024

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Mfr.Part #
XCVM1302-1LLINBVB1024
Manufacturer
AMD Xilinx
Package / Case
2.5 mm x 2 mm
Datasheet
Download
Description
IC VERSALPRIME ACAP FPGA 1024BGA
Stock
19,112
In Stock ：
19,112

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Brand :
CTS Electronic Components
Operating Temperature :
-40°C ~ 100°C (TJ)
Number of I/O :
316
Height :
1 mm
Supplier Device Package :
1024-BGA (31x31)
Package :
Tray
Product Category :
Standard Clock Oscillators
Length :
2.5 mm
Manufacturer :
CTS
Minimum Operating Temperature :
- 40 C
Maximum Operating Temperature :
+ 85 C
Output Format :
HCMOS
Termination Style :
SMD/SMT
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size :
-
Series :
625
Frequency :
3.6864 MHz
Operating Supply Voltage :
700 mV
Width :
2 mm
RoHS :
Details
Architecture :
MPU, FPGA
Package / Case :
2.5 mm x 2 mm
Packaging :
MouseReel
Speed :
400MHz, 1GHz
Load Capacitance :
15 pF
Frequency Stability :
50 PPM
RAM Size :
-
Peripherals :
DDR, DMA, PCIe
Primary Attributes :
Versal™ Prime FPGA, 70k Logic Cells
Subcategory :
Oscillators
Product Status :
Active
Product Type :
Standard Oscillators
Introducing System On Chip (SoC) AMD Xilinx XCVM1302-1LLINBVB1024 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C ~ 100°C (TJ), Package / Case：2.5 mm x 2 mm, XCVM1302-1LLINBVB1024 pinout, XCVM1302-1LLINBVB1024 datasheet PDF, XCVM1302-1LLINBVB1024 amp .Beyond System On Chip (SoC) AMD Xilinx XCVM1302-1LLINBVB1024 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



-40°C ~ 100°C (TJ) System On Chip 625 Series 316 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


On this SoC, there is Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor.Assigned with the package 2.5 mm x 2 mm, this system on a chip comes from the manufacturer.The - RAM implementation of this SoC chip ensures efficient performance for users.Using the MPU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the 625 series.Temperatures should be -40°C ~ 100°C (TJ) on average for this SoC meaning.In addition, this SoC security combines Versal™ Prime FPGA, 70k Logic Cells.It is packaged in a state-of-the-art MouseReel package.As a whole, this SoC part includes 316 I/Os.Likewise, it has a remarkable system on a chip capability, just like other high-quality Oscillators.There is a flash of - on it.It operates at a frequency of 3.6864 MHz.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVM1302-1LLINBVB1024 System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
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