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  6. XCVM1302-1LSINBVB1024
XCVM1302-1LSINBVB1024

XCVM1302-1LSINBVB1024

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Mfr.Part #
XCVM1302-1LSINBVB1024
Manufacturer
AMD Xilinx
Package / Case
1024-BFBGA
Datasheet
Download
Description
IC VERSALPRIME ACAP FPGA 1024BGA
Stock
46,181
In Stock ：
46,181

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture :
MPU, FPGA
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Number of I/O :
316
Peripherals :
DDR, DMA, PCIe
Flash Size :
-
Speed :
400MHz, 1GHz
Supplier Device Package :
1024-BGA (31x31)
Operating Temperature :
-40°C ~ 100°C (TJ)
Package / Case :
1024-BFBGA
Product Status :
Active
RAM Size :
-
Series :
Versal™ Prime
Primary Attributes :
Versal™ Prime FPGA, 70k Logic Cells
Package :
Tray
Introducing System On Chip (SoC) AMD Xilinx XCVM1302-1LSINBVB1024 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C ~ 100°C (TJ), Package / Case：1024-BFBGA, XCVM1302-1LSINBVB1024 pinout, XCVM1302-1LSINBVB1024 datasheet PDF, XCVM1302-1LSINBVB1024 amp .Beyond System On Chip (SoC) AMD Xilinx XCVM1302-1LSINBVB1024 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



-40°C ~ 100°C (TJ) System On Chip Versal™ Prime Series 316 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 1024-BFBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented - RAM.The internal architecture of this SoC design is based on the MPU, FPGA technique.In the Versal™ Prime series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C ~ 100°C (TJ).Taking note of the fact that this SoC security combines Versal™ Prime FPGA, 70k Logic Cells is important.In total, this SoC part has 316 I/Os.A flashing - appears on it.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of AMD


XCVM1302-1LSINBVB1024 System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
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