XCVM1402-2MSIVSVD1760

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Mfr.Part #
XCVM1402-2MSIVSVD1760
Manufacturer
AMD Xilinx
Package / Case
1760-BFBGA, FCBGA
Datasheet
Download
Description
IC VERSALPRIME ACAP FPGA 1760BGA
Stock
48,026
In Stock :
48,026

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Operating Temperature :
-40°C ~ 100°C (TJ)
Series :
Versal™ Prime
RAM Size :
-
Manufacturer :
Xilinx
Operating Supply Voltage :
800 mV
Maximum Operating Temperature :
+ 110 C
Product Status :
Active
Package :
Tray
Speed :
600MHz, 1.4GHz
Peripherals :
DDR, DMA, PCIe
Supplier Device Package :
1760-FCBGA (40x40)
Number of I/O :
726
Brand :
Xilinx
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Flash Size :
-
Minimum Operating Temperature :
- 40 C
Primary Attributes :
Versal™ Prime FPGA, 1.2M Logic Cells
Subcategory :
SOC - Systems on a Chip
Architecture :
MPU, FPGA
Product Type :
System-On-Modules - SOM
Package / Case :
1760-BFBGA, FCBGA
Product Category :
SoC FPGA
Introducing System On Chip (SoC) AMD Xilinx XCVM1402-2MSIVSVD1760 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 100°C (TJ), Package / Case:1760-BFBGA, FCBGA, XCVM1402-2MSIVSVD1760 pinout, XCVM1402-2MSIVSVD1760 datasheet PDF, XCVM1402-2MSIVSVD1760 amp .Beyond System On Chip (SoC) AMD Xilinx XCVM1402-2MSIVSVD1760 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVM1402-2MSIVSVD1760


-40°C ~ 100°C (TJ) System On Chip Versal™ Prime Series 726 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, this SoC has been developed.There is a 1760-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With - RAM implemented, this SoC chip provides reliable operation.A MPU, FPGA technique is used for the SoC design's internal architecture.Versal™ Prime is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C ~ 100°C (TJ) when it is operating normally.A significant feature of this SoC security is the combination of Versal™ Prime FPGA, 1.2M Logic Cells.As a whole, this SoC part is comprised of 726 inputs and outputs.Furthermore, it has a remarkable system on a chip capability, much like other high-quality SOC - Systems on a Chip.This flash has a size of -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVM1402-2MSIVSVD1760 System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control
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