XCVM1402-2LSEVSVD1760

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Mfr.Part #
XCVM1402-2LSEVSVD1760
Manufacturer
AMD Xilinx
Package / Case
7 mm x 5 mm
Datasheet
Download
Description
IC VERSALPRIME ACAP FPGA 1760BGA
Stock
45,437
In Stock :
45,437

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Frequency Stability :
25 ppm
Product Status :
Active
Number of I/O :
726
Product Type :
Standard Oscillators
Frequency :
148.35 MHz
Manufacturer :
CTS
Width :
5 mm
Package :
Tray
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Subcategory :
Oscillators
Minimum Operating Temperature :
- 40 C
Supplier Device Package :
1760-FCBGA (40x40)
Operating Supply Voltage :
700 mV
Flash Size :
-
Output Format :
LVDS
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Brand :
CTS Electronic Components
Primary Attributes :
Versal™ Prime FPGA, 1.2M Logic Cells
Length :
7 mm
Series :
637
Package / Case :
7 mm x 5 mm
RoHS :
Details
Speed :
450MHz, 1.08GHz
RAM Size :
-
Architecture :
MPU, FPGA
Operating Temperature :
0°C ~ 100°C (TJ)
Current Rating :
45 mA
Packaging :
Reel
Height :
1.7 mm
Maximum Operating Temperature :
+ 85 C
Peripherals :
DDR, DMA, PCIe
Termination Style :
SMD/SMT
Product Category :
Standard Clock Oscillators
Introducing System On Chip (SoC) AMD Xilinx XCVM1402-2LSEVSVD1760 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:7 mm x 5 mm, Operating Temperature:0°C ~ 100°C (TJ), XCVM1402-2LSEVSVD1760 pinout, XCVM1402-2LSEVSVD1760 datasheet PDF, XCVM1402-2LSEVSVD1760 amp .Beyond System On Chip (SoC) AMD Xilinx XCVM1402-2LSEVSVD1760 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVM1402-2LSEVSVD1760


0°C ~ 100°C (TJ) System On Chip 637 Series 726 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


A Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 7 mm x 5 mm package.With - RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MPU, FPGA technique.Featured system on chip SoCs of the 637 series.The average operating temps for this SoC meaning should be 0°C ~ 100°C (TJ).One important thing to mark down is that this SoC meaning combines Versal™ Prime FPGA, 1.2M Logic Cells.Housed in the state-of-art Reel package.726 I/Os in total are included in this SoC part.Just like other high-quality Oscillators will do, it is of outstanding system on a chip capability.It has a - flash.The wireless SoC works at a frequency of 148.35 MHz.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVM1402-2LSEVSVD1760 System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
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