XCVM1302-2LSENBVB1024

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Mfr.Part #
XCVM1302-2LSENBVB1024
Manufacturer
AMD Xilinx
Package / Case
1024-BFBGA
Datasheet
Download
Description
IC VERSALPRIME ACAP FPGA 1024BGA
Stock
33,768
In Stock :
33,768

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Product Length :
2 mm
Manufacturer :
Xilinx
Product Status :
Active
Resistance :
51 kOhm
Series :
Versal™ Prime
Resistance Tolerance :
5
Minimum Operating Temperature :
0 C
Product Type :
System-On-Modules - SOM
Flash Size :
-
Maximum Operating Temperature :
+ 110 C
Operating Supply Voltage :
700 mV
Architecture :
MPU, FPGA
Power Rating :
0.125 W
Resistor Type :
GENERAL PURPOSE
RAM Size :
-
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package :
Tray
Package / Case :
1024-BFBGA
Speed :
450MHz, 1.08GHz
Temperature Coefficient :
200 ppm/K
Number of I/O :
316
Supplier Device Package :
1024-BGA (31x31)
Brand :
Xilinx
Qualification :
AEC-Q200
Product Width :
1.25 mm
Product Category :
SoC FPGA
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Subcategory :
SOC - Systems on a Chip
Peripherals :
DDR, DMA, PCIe
Operating Temperature :
0°C ~ 100°C (TJ)
Primary Attributes :
Versal™ Prime FPGA, 70k Logic Cells
Introducing System On Chip (SoC) AMD Xilinx XCVM1302-2LSENBVB1024 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1024-BFBGA, Operating Temperature:0°C ~ 100°C (TJ), XCVM1302-2LSENBVB1024 pinout, XCVM1302-2LSENBVB1024 datasheet PDF, XCVM1302-2LSENBVB1024 amp .Beyond System On Chip (SoC) AMD Xilinx XCVM1302-2LSENBVB1024 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



0°C ~ 100°C (TJ) System On Chip Versal™ Prime Series 316 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


A core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 1024-BFBGA.With - RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MPU, FPGA architecture for its internal architecture.Versal™ Prime is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C ~ 100°C (TJ).This SoC security combines Versal™ Prime FPGA, 70k Logic Cells, an important feature to keep in mind.316 I/Os are available in this SoC part.There is no doubt that this system on a chip is outstanding, just as other high-quality SOC - Systems on a Chip will do.The flash size of the SoC meaning is -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVM1302-2LSENBVB1024 System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
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