XCVM1302-2LLEVSVD1760

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Mfr.Part #
XCVM1302-2LLEVSVD1760
Manufacturer
AMD Xilinx
Package / Case
1760-BFBGA, FCBGA
Datasheet
Download
Description
IC VERSALPRIME ACAP FPGA 1760BGA
Stock
42,757
In Stock :
42,757

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Series :
Versal™ Prime
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature :
0°C ~ 100°C (TJ)
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals :
DDR, DMA, PCIe
Package / Case :
1760-BFBGA, FCBGA
Flash Size :
-
Package :
Tray
Product Status :
Active
Speed :
450MHz, 1.08GHz
RAM Size :
-
Primary Attributes :
Versal™ Prime FPGA, 70k Logic Cells
Architecture :
MPU, FPGA
Supplier Device Package :
1760-FCBGA (40x40)
Number of I/O :
402
Introducing System On Chip (SoC) AMD Xilinx XCVM1302-2LLEVSVD1760 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 100°C (TJ), Package / Case:1760-BFBGA, FCBGA, XCVM1302-2LLEVSVD1760 pinout, XCVM1302-2LLEVSVD1760 datasheet PDF, XCVM1302-2LLEVSVD1760 amp .Beyond System On Chip (SoC) AMD Xilinx XCVM1302-2LLEVSVD1760 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVM1302-2LLEVSVD1760


0°C ~ 100°C (TJ) System On Chip Versal™ Prime Series 402 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, this SoC is built.Package 1760-BFBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with - RAM.This SoC design employs the MPU, FPGA technique for its internal architecture.The system on a chip is part of the series Versal™ Prime.This SoC meaning should have an average operating temperature of 0°C ~ 100°C (TJ).It is important to note that this SoC security combines Versal™ Prime FPGA, 70k Logic Cells.402 I/Os are included in this SoC part.A - flash can be seen on it.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of AMD


XCVM1302-2LLEVSVD1760 System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
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