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XCVM1302-2LLENSVF1369

XCVM1302-2LLENSVF1369

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Mfr.Part #
XCVM1302-2LLENSVF1369
Manufacturer
AMD Xilinx
Package / Case
1369-BFBGA
Datasheet
Download
Description
IC VERSALPRIME ACAP FPGA 1369BGA
Stock
32,625
In Stock ：
32,625

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Package / Case :
1369-BFBGA
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Peripherals :
DDR, DMA, PCIe
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature :
0°C ~ 100°C (TJ)
RAM Size :
-
Flash Size :
-
Number of I/O :
316
Package :
Tray
Architecture :
MPU, FPGA
Speed :
450MHz, 1.08GHz
Product Status :
Active
Supplier Device Package :
1369-BGA (35x35)
Primary Attributes :
Versal™ Prime FPGA, 70k Logic Cells
Series :
Versal™ Prime
Introducing System On Chip (SoC) AMD Xilinx XCVM1302-2LLENSVF1369 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1369-BFBGA, Operating Temperature：0°C ~ 100°C (TJ), XCVM1302-2LLENSVF1369 pinout, XCVM1302-2LLENSVF1369 datasheet PDF, XCVM1302-2LLENSVF1369 amp .Beyond System On Chip (SoC) AMD Xilinx XCVM1302-2LLENSVF1369 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



0°C ~ 100°C (TJ) System On Chip Versal™ Prime Series 316 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


A core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 1369-BFBGA.With - RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MPU, FPGA architecture for its internal architecture.Versal™ Prime is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C ~ 100°C (TJ).This SoC security combines Versal™ Prime FPGA, 70k Logic Cells, an important feature to keep in mind.316 I/Os are available in this SoC part.The flash size of the SoC meaning is -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of AMD


XCVM1302-2LLENSVF1369 System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
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