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XCVM1302-1MSENBVB1024

XCVM1302-1MSENBVB1024

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Mfr.Part #
XCVM1302-1MSENBVB1024
Manufacturer
AMD Xilinx
Package / Case
1024-BFBGA
Datasheet
Download
Description
IC VERSALPRIME ACAP FPGA 1024BGA
Stock
23,008
In Stock ：
23,008

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Supplier Device Package :
1024-BGA (31x31)
Product Type :
System-On-Modules - SOM
Number of I/O :
316
Resistor Type :
High Reliability
Series :
Versal™ Prime
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
RAM Size :
-
Product Status :
Active
Resistance Tolerance :
1
Power Rating :
0.05 W
Package / Case :
1024-BFBGA
Product Width :
0.51
Package :
Tray
Primary Attributes :
Versal™ Prime FPGA, 70k Logic Cells
Operating Supply Voltage :
800 mV
Speed :
600MHz, 1.3GHz
Resistance :
147 Ohm
Peripherals :
DDR, DMA, PCIe
Brand :
Xilinx
Product Category :
SoC FPGA
Product Length :
0.99
Subcategory :
SOC - Systems on a Chip
Minimum Operating Temperature :
0 C
Operating Temperature :
0°C ~ 100°C (TJ)
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer :
Xilinx
Architecture :
MPU, FPGA
Maximum Operating Temperature :
+ 100 C
Temperature Coefficient :
100 ppm/°C
Flash Size :
-
Introducing System On Chip (SoC) AMD Xilinx XCVM1302-1MSENBVB1024 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1024-BFBGA, Operating Temperature：0°C ~ 100°C (TJ), XCVM1302-1MSENBVB1024 pinout, XCVM1302-1MSENBVB1024 datasheet PDF, XCVM1302-1MSENBVB1024 amp .Beyond System On Chip (SoC) AMD Xilinx XCVM1302-1MSENBVB1024 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



0°C ~ 100°C (TJ) System On Chip Versal™ Prime Series 316 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


There are Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processors in this SoC.This system on a chip is packaged as 1024-BFBGA by the manufacturer.As this SoC chip has - RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MPU, FPGA method.The Versal™ Prime series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C ~ 100°C (TJ) on average.There is one thing to note about this SoC security: it combines Versal™ Prime FPGA, 70k Logic Cells.This SoC part has a total of 316 I/Os.As any high-quality SOC - Systems on a Chip, it is a system on a chip of outstanding capabilities.The flash is set to -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVM1302-1MSENBVB1024 System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
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