XCV812E-8FG900C

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Mfr.Part #
XCV812E-8FG900C
Manufacturer
AMD Xilinx
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 556 I/O 900FBGA
Stock
12,193
In Stock :
12,193

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Lead Free :
Contains Lead
Clock Frequency :
416MHz
Packaging :
Tray
Number of Logic Elements/Cells :
21168
RoHS Status :
Non-RoHS Compliant
Base Part Number :
XCV812E
Combinatorial Delay of a CLB-Max :
0.4 ns
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
225
Operating Supply Voltage :
1.8V
Pin Count :
900
Radiation Hardening :
No
Mounting Type :
Surface Mount
Terminal Position :
BOTTOM
Series :
Virtex®-E EM
Number of I/O :
556
Number of Pins :
900
Width :
31mm
Mount :
Surface Mount
Number of Outputs :
556
RAM Size :
140kB
Terminal Pitch :
1mm
Pbfree Code :
No
Time@Peak Reflow Temperature-Max (s) :
30
Number of Gates :
254016
JESD-609 Code :
e0
Package / Case :
900-BBGA
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of Terminations :
900
Number of LABs/CLBs :
4704
Voltage - Supply :
1.71V~1.89V
Height Seated (Max) :
2.6mm
Supply Voltage :
1.8V
Published :
1999
Total RAM Bits :
1146880
Length :
31mm
ECCN Code :
3A991.D
Speed Grade :
8
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
0°C~85°C TJ
Datasheets
XCV812E-8FG900C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV812E-8FG900C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV812E, Mounting Type:Surface Mount, Number of Pins:900, Package / Case:900-BBGA, Number of Terminations:900, Operating Temperature:0°C~85°C TJ, XCV812E-8FG900C pinout, XCV812E-8FG900C datasheet PDF, XCV812E-8FG900C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV812E-8FG900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV812E-8FG900C


FPGAs AMD Xilinx XCV812E-8FG900C Overview

AMD Xilinx XCV812E-8FG900C 是一款性能卓越的现场可编程门阵列(FPGA),采用 900FBGA 封装,拥有 556 个 I/O 接口。这款 FPGA 适用于广泛的高性能应用场景,如通信基础设施、数据中心和工业自动化。凭借其高密度和可配置性,XCV812E-8FG900C 能够满足各种定制化需求,是复杂系统的理想解决方案。这款FPGA的高计算能力和灵活的架构使其成为先进电子设计的最佳选择。

XCV812E-8FG900C Features

- 556 个 I/O 接口:提供充足的连接性和扩展能力 - 900FBGA 封装:确保稳定的性能和散热效果 - 高密度架构:适用于高性能和复杂设计 - 灵活配置:满足不同应用场景的需求 - 适用于通信、数据中心和工业自动化等领域

XCV812E-8FG900C Applications

- **通信基础设施**:在基站和光纤通信系统中提供高速信号处理和灵活的配置能力 - **数据中心**:为数据中心设备提供高密度和高性能计算能力 - **工业自动化**:在工业控制系统中实现灵活的硬件配置和可靠性 `
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