XCV800-5BG560C

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Mfr.Part #
XCV800-5BG560C
Manufacturer
AMD Xilinx
Package / Case
560-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 404 I/O 560MBGA
Stock
11,042
In Stock :
11,042

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Supply Voltage :
2.5V
Number of Logic Elements/Cells :
21168
Voltage - Supply :
2.375V~2.625V
Peak Reflow Temperature (Cel) :
225
Published :
2000
Time@Peak Reflow Temperature-Max (s) :
30
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Series :
Virtex®
Clock Frequency :
294MHz
Width :
42.5mm
Terminal Position :
BOTTOM
Mount :
Surface Mount
Mounting Type :
Surface Mount
Number of Inputs :
404
Length :
42.5mm
Number of Outputs :
404
RoHS Status :
Non-RoHS Compliant
JESD-30 Code :
S-PBGA-B560
Power Supplies :
1.2/3.62.5V
Total RAM Bits :
114688
Base Part Number :
XCV800
JESD-609 Code :
e0
Number of Gates :
888439
Operating Temperature :
0°C~85°C TJ
Terminal Finish :
Tin/Lead (Sn63Pb37)
Pin Count :
560
Package / Case :
560-LBGA Exposed Pad, Metal
Number of Terminations :
560
Lead Free :
Contains Lead
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
HTS Code :
8542.39.00.01
Terminal Pitch :
1.27mm
Pbfree Code :
No
Qualification Status :
Not Qualified
Terminal Form :
Ball
Reach Compliance Code :
not_compliant
Packaging :
Tray
Number of I/O :
404
ECCN Code :
EAR99
Height Seated (Max) :
1.7mm
Combinatorial Delay of a CLB-Max :
0.7 ns
RAM Size :
14kB
Number of LABs/CLBs :
4704
Datasheets
XCV800-5BG560C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV800-5BG560C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:XCV800, Operating Temperature:0°C~85°C TJ, Package / Case:560-LBGA Exposed Pad, Metal, Number of Terminations:560, XCV800-5BG560C pinout, XCV800-5BG560C datasheet PDF, XCV800-5BG560C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV800-5BG560C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.7mm mm FPGAs Virtex® Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

XCV800-5BG560C Overview


In the package 560-LBGA Exposed Pad, Metal, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 404 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 21168 logic elements/cells. Supply voltage is 2.5V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. This is a type of FPGA that is part of the Virtex® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 404 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 560. Fpga electronics is worth mentioning that this device provides 114688 bfpga electronics s of RAM. XCV800 is the base part number that can be used to identify related parts. The RAM si14kBe of this FPGA module reaches 14kB so as to guarantee the normal operation of the program during operation. The FPGA is built as an array of 4704 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. This is a battery operated device that operates on 1.2/3.62.5V. A basic building block for this type of building block consists of 888439 gates. I am going to present you with a device that is equipped with 560 pins. Fpga semiconductor typically uses a crystal oscillating at 294MHz.

XCV800-5BG560C Features


404 I/Os
Up to 114688 RAM bits


XCV800-5BG560C Applications


There are a lot of Xilinx Inc.
XCV800-5BG560C FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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