XCV800-5FG676C
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- Mfr.Part #
- XCV800-5FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 444 I/O 676FCBGA
- Stock
- 43,429
- In Stock ：
- 43,429
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- HTS Code :
- 8542.39.00.01
- Mount :
- Surface Mount
- Supply Voltage :
- 2.5V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- EAR99
- Reach Compliance Code :
- not_compliant
- Length :
- 27mm
- Lead Free :
- Contains Lead
- Number of Terminations :
- 676
- Voltage - Supply :
- 2.375V~2.625V
- Height Seated (Max) :
- 2.6mm
- Number of Logic Elements/Cells :
- 21168
- RoHS Status :
- Non-RoHS Compliant
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Packaging :
- Tray
- Qualification Status :
- Not Qualified
- Power Supplies :
- 1.2/3.62.5V
- Total RAM Bits :
- 114688
- JESD-30 Code :
- S-PBGA-B676
- Mounting Type :
- Surface Mount
- Number of Inputs :
- 444
- RAM Size :
- 14kB
- Peak Reflow Temperature (Cel) :
- 225
- Number of Outputs :
- 444
- Base Part Number :
- XCV800
- JESD-609 Code :
- e0
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 676
- Number of Gates :
- 888439
- Terminal Form :
- Ball
- Number of LABs/CLBs :
- 4704
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Published :
- 2000
- Package / Case :
- 676-BBGA, FCBGA
- Series :
- Virtex®
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 294MHz
- Width :
- 27mm
- Number of I/O :
- 444
- Pbfree Code :
- No
- Terminal Pitch :
- 1mm
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- XCV800-5FG676C
FPGAs AMD Xilinx XCV800-5FG676C Overview
The FPGAs AMD Xilinx XCV800-5FG676C is a highly capable integrated circuit designed for robust field-programmable gate array (FPGA) applications. Manufactured by AMD Xilinx, this FPGA excels in delivering exceptional performance and flexibility. It supports a broad array of applications thanks to its dense logic capacity and high I/O bandwidth. This model comes in a 676-pin flip-chip ball grid array (FCBGA) package, which enhances its reliability and thermal performance in demanding environments. The XCV800-5FG676C is engineered to meet the complex and evolving needs of modern digital systems, providing designers with the ability to optimize their hardware acceleration and system integration tasks effectively.
XCV800-5FG676C Features
This FPGA features a comprehensive set of capabilities tailored for high-speed and complex digital processing tasks. Key features include a total of 444 configurable I/O ports, facilitating extensive interfacing with other digital components. Additionally, the high-density logic cells embedded within allow for efficient data handling and processing, which is critical for advanced computing applications. The package's 676FCBGA format ensures robust physical integration and enhanced durability, making it suitable for industrial-grade applications.
XCV800-5FG676C Applications
- Telecommunications Equipment: The high I/O count and flexible logic configuration enable this FPGA to handle multiple data streams simultaneously, which is essential for routers, switches, and base station developments.
- Data Centers: Suitable for acceleration hardware, this FPGA can be deployed in servers to speed up data processing and increase the efficiency of cloud computing solutions.
- Automotive Technology: Can be used in advanced driver-assistance systems (ADAS) to process real-time sensor data and support decision-making processes in autonomous and semi-autonomous vehicles.
- Consumer Electronics: Ideal for high-definition video processing and complex digital signal management in devices such as smartphones, tablets, and smart TVs.
- Industrial Automation: Helps in the management and control of industrial robotics and machinery, ensuring high precision and operational reliability in production lines.
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