XCV812E-7FG900C
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- Mfr.Part #
- XCV812E-7FG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 556 I/O 900FBGA
- Stock
- 29,384
- In Stock ：
- 29,384
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Terminations :
- 900
- Number of Pins :
- 900
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 2.6mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Gates :
- 254016
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 31mm
- Peak Reflow Temperature (Cel) :
- 225
- Combinatorial Delay of a CLB-Max :
- 0.42 ns
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 1146880
- Operating Supply Voltage :
- 1.8V
- RAM Size :
- 140kB
- Number of LABs/CLBs :
- 4704
- Number of I/O :
- 556
- Pbfree Code :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- 3A991.D
- Base Part Number :
- XCV812E
- Packaging :
- Tray
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- 0°C~85°C TJ
- Length :
- 31mm
- Speed Grade :
- 7
- Package / Case :
- 900-BBGA
- Supply Voltage :
- 1.8V
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 556
- Terminal Pitch :
- 1mm
- Series :
- Virtex®-E EM
- Published :
- 1999
- Mount :
- Surface Mount
- Lead Free :
- Contains Lead
- JESD-609 Code :
- e0
- Pin Count :
- 900
- Voltage - Supply :
- 1.71V~1.89V
- Radiation Hardening :
- No
- Clock Frequency :
- 400MHz
- Number of Logic Elements/Cells :
- 21168
- Datasheets
- XCV812E-7FG900C
FPGAs AMD Xilinx XCV812E-7FG900C Overview
The AMD Xilinx XCV812E-7FG900C FPGA offers a sophisticated platform designed for high-performance applications requiring significant programmability and computational power. This FPGA integrates 556 I/Os within a compact 900FBGA package, enabling efficient communication and functionality in complex electronic systems. Its robust architecture and high-speed signal processing capabilities make it ideal for developers looking to push the boundaries of technology in fields such as telecommunications and advanced computing. The use of the FPGAs AMD Xilinx XCV812E-7FG900C in your designs ensures scalability, longevity, and cutting-edge performance, crucial for maintaining competitiveness in fast-evolving technological landscapes.
XCV812E-7FG900C Features
This FPGA model boasts a dense array of features suitable for a wide range of applications. Key features include a high I/O count, large programmable logic capacities, and support for high-speed data transmission, all housed in a fine-pitch 900-ball grid array (FBGA) package. The device supports various logic optimization techniques, which provide significant advantages in power efficiency and operational speed, enhancing overall system reliability and performance.
XCV812E-7FG900C Applications
- Telecommunications: The FPGA can be used to develop infrastructure for both wired and wireless communication technologies, supporting fast data processing and improved signal integrity.
- Data Centers: Suitable for handling complex algorithms required for data processing and storage management, enhancing efficiency and reducing latency in network operations.
- Aerospace and Defense: This device meets the rigorous demands for processing and reliability in aerospace and defense applications, facilitating navigation and control systems.
- Automotive: Critical for developing advanced driver-assistance systems (ADAS), the FPGA's processing capabilities enable real-time decision-making and vehicle system management.
- Industrial Automation: Helps in the design of machinery control systems that require high-speed automation and precise control for increased production efficiency.
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