XCV812E-6FG900C
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- Mfr.Part #
- XCV812E-6FG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 556 I/O 900FBGA
- Stock
- 13,521
- In Stock ：
- 13,521
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Pitch :
- 1mm
- Base Part Number :
- XCV812E
- Pbfree Code :
- No
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Published :
- 2002
- Number of Outputs :
- 556
- Number of I/O :
- 556
- ECCN Code :
- 3A991.D
- Width :
- 31mm
- Number of Gates :
- 254016
- Supply Voltage :
- 1.8V
- Operating Supply Voltage :
- 1.8V
- Voltage - Supply :
- 1.71V~1.89V
- RAM Size :
- 140kB
- Clock Frequency :
- 357MHz
- Time@Peak Reflow Temperature-Max (s) :
- 30
- HTS Code :
- 8542.39.00.01
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- Series :
- Virtex®-E EM
- Pin Count :
- 900
- Operating Temperature :
- 0°C~85°C TJ
- Total RAM Bits :
- 1146880
- Number of Logic Elements/Cells :
- 21168
- JESD-609 Code :
- e0
- RoHS Status :
- Non-RoHS Compliant
- Length :
- 31mm
- Lead Free :
- Contains Lead
- Packaging :
- Tray
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Radiation Hardening :
- No
- Package / Case :
- 900-BBGA
- Peak Reflow Temperature (Cel) :
- 225
- Number of Pins :
- 900
- Mount :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Terminations :
- 900
- Speed Grade :
- 6
- Mounting Type :
- Surface Mount
- Number of LABs/CLBs :
- 4704
- Datasheets
- XCV812E-6FG900C
FPGAs AMD Xilinx XCV812E-6FG900C Overview
The FPGAs AMD Xilinx XCV812E-6FG900C is a highly capable field-programmable gate array designed for versatility and optimal performance across a wide range of applications. This FPGA integrates 556 I/Os within a compact 900FBGA package, making it an ideal choice for developers looking to leverage advanced digital circuitry with a high degree of customization. The product's robust configuration allows for efficient handling of complex algorithms and processes, which is crucial for high-speed and demanding operational environments. Emphasizing on flexibility, the XCV812E-6FG900C from AMD Xilinx enables enterprises to rapidly prototype and scale their solutions, reducing time-to-market and enhancing product reliability.
XCV812E-6FG900C Features
The AMD Xilinx XCV812E-6FG900C FPGA offers a broad range of features designed to support complex and high-speed digital functionalities. Key attributes include its large number of input/output ports which provide extensive interfacing capabilities, and its highly scalable 900FBGA packaging which ensures a compact footprint along with superior performance. This component is particularly well-suited for advanced digital computations and high-density integrations, facilitating sophisticated designs and applications in various technological fields.
XCV812E-6FG900C Applications
- Telecommunications: Utilized in communication infrastructure, the XCV812E-6FG900C supports high-speed data transmission and advanced signal processing capabilities required for next-generation networking equipment.
- Data Centers: Ideal for data center applications, this FPGA can manage complex data processing tasks efficiently, supporting cloud computing and large-scale storage solutions.
- Automotive: In automotive technology, the XCV812E-6FG900C helps to handle real-time processing for advanced driver-assistance systems (ADAS), ensuring rapid data processing and enhanced vehicle safety.
- Industrial Automation: This FPGA is crucial for industrial automation systems, facilitating the control and operation of machinery in a precise and reliable manner.
- Consumer Electronics: Applied in various consumer electronics, such as smart home devices and high-performance gaming systems, the XCV812E-6FG900C enables sophisticated user interfaces and connectivity solutions.
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