XCV812E-6BG560C
- Mfr.Part #
- XCV812E-6BG560C
- Manufacturer
- AMD Xilinx
- Package / Case
- 560-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 404 I/O 560MBGA
- Stock
- 20,687
- In Stock :
- 20,687
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Temperature :
- 0°C~85°C TJ
- Lead Free :
- Contains Lead
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Radiation Hardening :
- No
- Voltage - Supply :
- 1.71V~1.89V
- Length :
- 42.5mm
- Peak Reflow Temperature (Cel) :
- 225
- Pin Count :
- 560
- Height Seated (Max) :
- 1.7mm
- HTS Code :
- 8542.39.00.01
- Published :
- 2002
- Supply Voltage :
- 1.8V
- Base Part Number :
- XCV812E
- Number of Outputs :
- 404
- Terminal Position :
- BOTTOM
- Number of Terminations :
- 560
- Number of LABs/CLBs :
- 4704
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- Number of Inputs :
- 404
- Clock Frequency :
- 357MHz
- Terminal Form :
- Ball
- ECCN Code :
- 3A991.D
- JESD-609 Code :
- e0
- Operating Supply Voltage :
- 1.8V
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- RoHS Status :
- Non-RoHS Compliant
- Width :
- 42.5mm
- Series :
- Virtex®-E EM
- Package / Case :
- 560-LBGA Exposed Pad, Metal
- Number of I/O :
- 404
- Speed Grade :
- 6
- Number of Gates :
- 254016
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pbfree Code :
- No
- Number of Logic Elements/Cells :
- 21168
- Mount :
- Surface Mount
- Terminal Pitch :
- 1.27mm
- Total RAM Bits :
- 1146880
- RAM Size :
- 140kB
- Packaging :
- Tray
- Datasheets
- XCV812E-6BG560C
1.8V V 1.7mm mm FPGAs Virtex®-E EM Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560
XCV812E-6BG560C Overview
A 560-LBGA Exposed Pad, Metal package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 404 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 21168 logic elements/cells. An electrical supply voltage of 1.8V powers it. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.71V~1.89V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Virtex®-E EM series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 404 different outputs included. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 560 terminations. The RAM bits that are offered by this fpga chips are 1146880. Related parts can be found by using its base part number XCV812E. The FPGA module's RAM si140kBe reaches 140kB in order to ensure that the program operates in a normal manner. Fpga electronics contains 4704 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.8V-volt supply allows designers to fully utilize its flexibility. Among its basic building blocks, there are 254016 gates that are included in it. In addition to this, it has 560 pins. Normally, fpga semiconductor uses an oscillator, which oscillates at 357MHz, to create the signal.
XCV812E-6BG560C Features
404 I/Os
Up to 1146880 RAM bits
XCV812E-6BG560C Applications
There are a lot of Xilinx Inc.
XCV812E-6BG560C FPGAs applications.
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
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