XCV812E-6BG560C

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Mfr.Part #
XCV812E-6BG560C
Manufacturer
AMD Xilinx
Package / Case
560-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 404 I/O 560MBGA
Stock
20,687
In Stock :
20,687

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
0°C~85°C TJ
Lead Free :
Contains Lead
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Radiation Hardening :
No
Voltage - Supply :
1.71V~1.89V
Length :
42.5mm
Peak Reflow Temperature (Cel) :
225
Pin Count :
560
Height Seated (Max) :
1.7mm
HTS Code :
8542.39.00.01
Published :
2002
Supply Voltage :
1.8V
Base Part Number :
XCV812E
Number of Outputs :
404
Terminal Position :
BOTTOM
Number of Terminations :
560
Number of LABs/CLBs :
4704
Time@Peak Reflow Temperature-Max (s) :
30
Mounting Type :
Surface Mount
Number of Inputs :
404
Clock Frequency :
357MHz
Terminal Form :
Ball
ECCN Code :
3A991.D
JESD-609 Code :
e0
Operating Supply Voltage :
1.8V
Combinatorial Delay of a CLB-Max :
0.47 ns
RoHS Status :
Non-RoHS Compliant
Width :
42.5mm
Series :
Virtex®-E EM
Package / Case :
560-LBGA Exposed Pad, Metal
Number of I/O :
404
Speed Grade :
6
Number of Gates :
254016
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pbfree Code :
No
Number of Logic Elements/Cells :
21168
Mount :
Surface Mount
Terminal Pitch :
1.27mm
Total RAM Bits :
1146880
RAM Size :
140kB
Packaging :
Tray
Datasheets
XCV812E-6BG560C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV812E-6BG560C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Base Part Number:XCV812E, Number of Terminations:560, Mounting Type:Surface Mount, Package / Case:560-LBGA Exposed Pad, Metal, XCV812E-6BG560C pinout, XCV812E-6BG560C datasheet PDF, XCV812E-6BG560C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV812E-6BG560C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E EM Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

XCV812E-6BG560C Overview


A 560-LBGA Exposed Pad, Metal package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 404 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 21168 logic elements/cells. An electrical supply voltage of 1.8V powers it. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.71V~1.89V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Virtex®-E EM series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 404 different outputs included. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 560 terminations. The RAM bits that are offered by this fpga chips are 1146880. Related parts can be found by using its base part number XCV812E. The FPGA module's RAM si140kBe reaches 140kB in order to ensure that the program operates in a normal manner. Fpga electronics contains 4704 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.8V-volt supply allows designers to fully utilize its flexibility. Among its basic building blocks, there are 254016 gates that are included in it. In addition to this, it has 560 pins. Normally, fpga semiconductor uses an oscillator, which oscillates at 357MHz, to create the signal.

XCV812E-6BG560C Features


404 I/Os
Up to 1146880 RAM bits


XCV812E-6BG560C Applications


There are a lot of Xilinx Inc.
XCV812E-6BG560C FPGAs applications.


  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
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